EA-XPR-003 Embedded Artists, EA-XPR-003 Datasheet - Page 43

• Manufacturer Part Number: EA-XPR-003
• Description: BOARD LPCXPRESSO LPC1768
• Manufacturer: Embedded Artists
• Series: LPCXpressor
• Type: MCUr

Specifications of EA-XPR-003

• Contents: Board, Software
• For Use With/related Products: EA-XPR-021, ARM Cortex-M3
• For Use With: EA-XPR-021 - BOARD BASE LPCXPRESSO
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

NXP Semiconductors
9. Thermal characteristics
Table 6.
V
LPC1769_68_67_66_65_64_63
Product data sheet
Symbol
T
DD
j(max)
= 2.4 V to 3.6 V; T
Thermal characteristics
Parameter
maximum junction
temperature
amb
The average chip junction temperature, T
equation:
The internal power dissipation is the product of I
the I/O pins is often small and many times can be negligible. However it can be significant
in some applications.
T
=
•
•
•
j
−
=
T
R
P
40
amb
D
T
th(j-a)
amb
°
= sum of internal and I/O power dissipation
C to +85
= ambient temperature (°C),
+
= the package junction-to-ambient thermal resistance (°C/W)
(
P
D
All information provided in this document is subject to legal disclaimers.
°
Conditions
×
C unless otherwise specified;
R
th j a
(
Rev. 6.01 — 11 March 2011
–
)
)
LPC1769/68/67/66/65/64/63
j
(°C), can be calculated using the following
Min
-
DD
32-bit ARM Cortex-M3 microcontroller
and V
DD
Typ
-
. The I/O power dissipation of
Max
125
© NXP B.V. 2011. All rights reserved.
Unit
°C
43 of 79
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