75003-0310 Molex Inc, 75003-0310 Datasheet - Page 3

• Manufacturer Part Number: 75003-0310
• Description: CONN PLUG 12POS 1.2MM VERT SMD
• Manufacturer: Molex Inc
• Series: Plateau HS Mezz™ 75003r

Specifications of 75003-0310

• Connector Type: Differential Pair Array, Male
• Number Of Positions: 12
• Pitch: 0.047" (1.20mm)
• Number Of Rows: 2
• Mounting Type: Surface Mount
• Features: Board Guide
• Contact Finish: Gold
• Contact Finish Thickness: 30µin (0.76µm)
• Mated Stacking Heights: 15mm, 17mm, 25mm
• Height Above Board: 0.522" (13.25mm)
• Pitch Spacing: 1.2mm
• No. Of Contacts: 12
• Gender: Plug
• Contact Plating: Gold
• No. Of Rows: 2
• Contact Termination: Surface Mount Vertical
• Product Type: Receptacles
• Mounting Style: Wire
• Number Of Positions / Contacts: 12
• Housing Material: High Temperature Thermoplastic
• Contact Material: High Performance Alloy (HPA)
• Voltage Rating: 30 V
• Current Rating: 1.5 A
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 075003-0310; 075003-0310-E; 0750030310; 0750030310-E; 75003-0310-E; 750030310; 750030310-E; WM17210

REVISION:
DOCUMENT NUMBER:
B
4.0 Testing Sequences
LLCR or Contact Resistance (5.2.1)
Dielectric Withstanding Voltage (5.2.2)
Durability (5.3.2)
Durability (preconditioning) (5.3.3)
Reseating (5.3.4)
Vibration (5.3.5)
Thermal Shock (5.4.1)
Temperature Life (5.4.2)
Temperature Life (preconditioning) (5.4.3)
Humidity - Temp. Cycling (5.4.4)
Thermal Disturbance (5.4.5)
Thermal Cycling (5.4.7)
Mixed Flowing Gas (FMG) (5.4.6)
Notes:
1) The sample size for sequences 1-3, and 5 consisted of 5 High Speed Mezzanine Assemblies and 12
2) The sample size for sequence 4, consisted of 10 High Speed Mezzanine Assemblies and 24
3) The sample size for sequence 4 also included 2 high speed test boards with assemblies that will be
4.1 Sample Preparation
4.2 EIA 364 Sequences
TS-75005-001
Individual Ground Assemblies. (75005-0006 and 75003-0008)
sent through the entire sequence. The boards will be checked for any change in the High Speed
performance of the connectors.
Individual Ground Assemblies. (75005-0006 and 75003-0008)
All samples were prepared and reflowed using the appropriate EIA standards and processing
specifications laid out in the High Speed Mezzanine Application Specification (AS-75005-001).
ECR/ECN INFORMATION:
EC No:
DATE:
Test or Examination
UCP2003-2204
2003 / 04 / 10
Sample Size
HIGH SPEED MEZZANINE
TITLE:
CREATED / REVISED BY:
TEST SUMMARY
Ken Stiles
BOARD TO BOARD CONNECTOR SYSTEM
1, 4, 6
5/12
2
5
3
1
TEST SUMMARY FOR THE
HIGH SPEED MEZZANINE
EIA-364-1000.01 Test Group Sequences
1, 4, 6, 8
5/12
2
2
7
3
5
CHECKED BY:
Ken Stiles
1, 4, 6
5/12
3
2
5
3
TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A](V.1).DOC
1, 4, 6, 8,10
10/24
4
2
9
3
7
5
Manny Banakis
APPROVED BY:
1, 4, 6, 8
5/12
5
2
7
3
5
SHEET No.
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of
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