75003-0005 Molex Inc, 75003-0005 Datasheet
75003-0005
Specifications of 75003-0005
075003-0005-E
0750030005
0750030005-E
75003-0005-E
750030005
750030005-E
WM17211
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75003-0005 Summary of contents
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... ECR/ECN INFORMATION: UCP2003-2204 EC No: C DATE: 2003 / DOCUMENT NUMBER: AS-75005-001 HIGH SPEED MEZZANINE 75003 Plug Assembly Table of Contents Scope Product Description Applicable Documents and Specifications Insertion and Withdrawal of Connectors 4.1 Recommended Insertion and Withdrawal 4.2 Maximum Offset 4.3 Mating Sequence Application to PCB 5 ...
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... PRODUCT DESCRIPTION 2.1 Product Name and Part Numbers: High Speed Mezzanine Connector Plug Assemblies Series 75003 Receptacle Assemblies Series 75005 2.2 Dimensions, Materials, Platings, and Markings: (See appropriate sales drawings for information) 3.0 APPLICABLE DOCUMENTS AND SPECIFICATIONS ...
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HIGH SPEED MEZZANINE APPLICATION SPECIFICATION 4.0 INSERTION AND WITHDRAWAL This section describes the preferred methods for inserting and withdrawing the High Speed Mezzanine connectors. It also describes the special zippering feature of this connector which allows for the full rotation ...
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HIGH SPEED MEZZANINE APPLICATION SPECIFICATION 4.2 Maximum Offset in X and Y Direction During Insertion: Centerline Centerline Centerline Centerline Centerline Centerline X-Direction 4.3 Mating Sequence During Insertion: Step 1 Step 1 Step 1 Step 3 Step 3 Step 3 Mating ...
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HIGH SPEED MEZZANINE APPLICATION SPECIFICATION 5.0 Application to PCB This product is designed for Pin thru Paste attachment and recommended for convection or IR reflow processing. Refer to the following sections for information on the proper solder stencil layout, reflow ...
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HIGH SPEED MEZZANINE APPLICATION SPECIFICATION 5.2 Recommended Reflow and Rework Temperatures: Initial Attach: 1) Maximum Reflow Temperature: 240 2) Maximum Reflow Shear Rate: 2 Rework: 1) Rework of the connector requires a full replacement. 2) Rework of the connector requires ...
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HIGH SPEED MEZZANINE APPLICATION SPECIFICATION 5.4 Inspection: NOTE: The Ground Peg has been tested and qualified without protruding below the surface of the PCB. This connector uses a Pin-thru-Paste application and only requires that >50% of the peg is covered ...
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... Not Tooled 75005-0004 Not Tooled 75005-0104 Not Tooled 75005-0204 Not Tooled 75005-0306 75003-0305 75005-0006 75003-0005 75005-0304 75003-0308 75005-0004 75003-0008 75005-0104 Not Tooled 75005-0204 Not Tooled 75005-0304 75003-0310 75005-0004 75003-0010 75005-0104 75003-0110 75005-0204 75003-0210 75005-0306 ...
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... Not Tooled Not Tooled Not Tooled Not Tooled Not Tooled Not Tooled Not Tooled Not Tooled Not Tooled 75003-0305 Not Tooled 75003-0005 Not Tooled 75003-0105 Not Tooled 75003-0205 Not Tooled Not Tooled Not Tooled Not Tooled Not Tooled Not Tooled Not Tooled ...