2QSP16-TG2-222 Bourns Inc., 2QSP16-TG2-222 Datasheet - Page 2

• Manufacturer Part Number: 2QSP16-TG2-222
• Description: RESNET 2.2K OHM16PIN BUSSED QSOP
• Manufacturer: Bourns Inc.
• Series: 2QSPr

Specifications of 2QSP16-TG2-222

• Resistance (ohms): 2.2K
• Number Of Resistors: 15
• Circuit Type: Bussed
• Temperature Coefficient: ±100ppm/°C
• Tolerance: ±2%
• Power Per Element: 100mW
• Number Of Pins: 16
• Package / Case: 16-LSSOP (0.154", 3.91mm Width)
• Size / Dimension: 0.196" L x 0.157" W (4.98mm x 3.99mm)
• Height: 0.069" (1.75mm)
• Mounting Type: Surface Mount
• Operating Temperature: -55°C ~ 125°C

Mechanical Characteristics
QSOP Package Dimensions
Thin Film on Silicon 2QSP / 2NBS -XX2 Bussed Resistors
Governing dimensions are in mm. Dimensions in
parentheses are in inches and are approximate.
JEDEC Reference Number MO-137.
(.150 - .157)
3.81 - 3.99
2QSP16
2QSP20
2QSP24
2QSP28
Model
PIN 1
0-8 °
(.053 - .069)
1.35 - 1.75
(.004 - .010)
.10 - .25
(.228 - .244)
5.80 - 6.20
4.80 - 4.98 (.189 - .196)
8.56 - 8.74 (.337 - .344)
8.56 - 8.74 (.337 - .344)
9.80 - 9.98 (.386 - .393)
(.025)
.635
A
(.008 - .012)
TYP.
.21 - .31
A
(.007 - .010)
(.016 - .050)
.41 - 1.27
.19 - .25
Narrow-Body SOIC Package Dimensions
Customers should verify actual device performance in their specific applications.
Governing dimensions are in mm. Dimensions in
parentheses are in inches and are approximate.
JEDEC Reference Number MS-012.
(.150 - .157)
3.81 - 3.99
2NBS08
2NBS14
2NBS16
Model
PIN 1
0-8 °
(.053 - .069)
1.35 - 1.75
(.004 - .010)
.10 - .25
(.228 - .244)
4.80 - 4.98 (.189 - .196)
8.56 - 8.74 (.337 - .344)
9.80 - 9.98 (.386 - .393)
Specifications are subject to change without notice.
5.80 - 6.20
(.050)
(.014 - .018)
1.27
0.36 - 0.46
A
TYP.
A
(.007 - .010)
(.016 - .050)
.41 - 1.27
.19 - .25