SGA-9289Z Sirenza Microdevices Inc, SGA-9289Z Datasheet - Page 4

• Manufacturer Part Number: SGA-9289Z
• Description: IC AMP HBT SIGE 3GHZ SOT-89
• Manufacturer: Sirenza Microdevices Inc

Specifications of SGA-9289Z

• Current - Supply: 250mA ~ 320mA
• Frequency: 0Hz ~ 3GHz
• Gain: 11dB ~ 13dB
• Noise Figure: 2.5dB
• P1db: 26dBm ~ 27.5dBm
• Package / Case: SOT-89
• Rf Type: WLL, WLAN
• Test Frequency: 1.96GHz
• Voltage - Supply: 5.5V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 599-1057-2

SGA-9289(Z)
Mounting and Thermal Considerations
It is very important that adequate heat sinking be provided to minimize the device junction temperature. The following items
should be implemented to maximize MTTF and RF performance.
1. Multiple solder-filled vias are required directly below the ground tab (pin 4). [CRITICAL]
2. Incorporate a large ground pad area with multiple plated-through vias around pin 4 of the device. [CRITICAL]
3. Use two point board seating to lower the thermal resistance between the PCB and mounting plate. Place machine screws as
close to the ground tab (pin 4) as possible. [RECOMMENDED]
4. Use 2 ounce copper to improve the PCB’s heat spreading capability. [RECOMMENDED]
4 of 6
Pin
1
2
3
4
Recommended Mounting Configuration for Optimum RF and Thermal
Collector
Function
Emitter
Emitter
Base
Description
RF input.
Connection to ground. Use via holes to reduce lead inductance. Place vias as close to ground leads as possible.
RF output.
Same as pin 2.
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at ([phone] or [e-mail].
(0.020" DIA)
Plated Thru
Machine
Screws
Holes
Performance
Ground Plane
Package
SOT-89
EDS-101498 Rev H