UPC8182TB-A CEL, UPC8182TB-A Datasheet - Page 15

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UPC8182TB-A

Manufacturer Part Number
UPC8182TB-A
Description
IC MMIC AMP 6-SUPER MINIMOLD
Manufacturer
CEL
Type
RF IC'sr
Datasheet

Specifications of UPC8182TB-A

Current - Supply
30mA
Frequency
1.9GHz ~ 2.4GHz
Gain
20.5dB
P1db
9dBm
Package / Case
SC-70-6, SC-88, SOT-363
Rf Type
General Purpose
Test Frequency
1.9GHz
Voltage - Supply
2.7V ~ 3.3V
Mounting Style
SMD/SMT
Operating Frequency
2.9 GHz
Noise Figure
5 dB
Operating Supply Voltage
2.7 V to 3.3 V
Supply Current
30 mA
Maximum Power Dissipation
270 mW
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
NOTES ON CORRECT USE
RECOMMENDED SOLDERING CONDITIONS
methods and conditions other than those recommended below, contact your nearby sales office.
Infrared Reflow
VPS
Wave Soldering
Partial Heating
Caution Do not use different soldering methods together (except for partial heating).
(1) Observe precautions for handling because of electro-static sensitive devices.
(2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired oscillation).
(3) The bypass capacitor should be attached to the V
(4) The inductor must be attached between V
(5) The DC cut capacitor must be attached to input and output pin.
This product should be soldered and mounted under the following recommended conditions.
Soldering Method
All the ground pins must be connected together with wide ground pattern to decrease impedance difference.
accordance with desired frequency.
Peak temperature (package surface temperature)
Time at peak temperature
Time at temperature of 220°C or higher
Preheating time at 120 to 180°C
Maximum number of reflow processes
Maximum chlorine content of rosin flux (% mass)
Peak temperature (package surface temperature)
Time at temperature of 200°C or higher
Preheating time at 120 to 150°C
Maximum number of reflow processes
Maximum chlorine content of rosin flux (% mass)
Peak temperature (molten solder temperature)
Time at peak temperature
Preheating temperature (package surface temperature) : 120°C or below
Maximum number of flow processes
Maximum chlorine content of rosin flux (% mass)
Peak temperature (pin temperature)
Soldering time (per side of device)
Maximum chlorine content of rosin flux (% mass)
Data Sheet PU10206EJ01V0DS
CC
Soldering Conditions
and output pins. The inductance value should be determined in
CC
pin.
: 260°C or below
: 120±30 seconds
: 215°C or below
: 30 to 60 seconds
: 260°C or below
: 1 time
: 350°C or below
: 3 seconds or less
: 10 seconds or less
: 60 seconds or less
: 3 times
: 0.2%(Wt.) or below
: 25 to 40 seconds
: 3 times
: 0.2%(Wt.) or below
: 10 seconds or less
: 0.2%(Wt.) or below
: 0.2%(Wt.) or below
Condition Symbol
µ
WS260
VP215
HS350
For soldering
IR260
PC8182TB
15

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