UPC2746TB-A CEL, UPC2746TB-A Datasheet - Page 17

• Manufacturer Part Number: UPC2746TB-A
• Description: MMIC AMP 1.5GHZ SOT-363
• Manufacturer: CEL
• Type: RF IC'sr

Specifications of UPC2746TB-A

• Current - Supply: 7.5mA
• Frequency: 100MHz ~ 1.5GHz
• Gain: 19dB
• Noise Figure: 4dB
• Package / Case: SC-70-6, SC-88, SOT-363
• Rf Type: General Purpose
• Voltage - Supply: 1.8V ~ 3.3V
• Mounting Style: SMD/SMT
• Operating Frequency: 2.7 GHz
• Operating Supply Voltage: 1.8 V to 3.3 V
• Supply Current: 7.5 mA
• Maximum Power Dissipation: 270 mW
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• P1db: -
• Test Frequency: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

NOTES ON CORRECT USE
(1) Observe precautions for handling because of electro-static sensitive devices.
(2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired oscillation).
(3) The bypass capacitor should be attached to the V
(4) The DC cut capacitor must be attached to input pin and output pin.
RECOMMENDED SOLDERING CONDITIONS
methods and conditions other than those recommended below, contact your nearby sales office.
17
Infrared Reflow
VPS
Wave Soldering
Partial Heating
This product should be soldered and mounted under the following recommended conditions.
Caution Do not use different soldering methods together (except for partial heating).
All the ground pins must be connected together with wide ground pattern to decrease impedance difference.
Soldering Method
Peak temperature (package surface temperature)
Time at peak temperature
Time at temperature of 220°C or higher
Preheating time at 120 to 180°C
Maximum number of reflow processes
Maximum chlorine content of rosin flux (% mass)
Peak temperature (package surface temperature)
Time at temperature of 200°C or higher
Preheating time at 120 to 150°C
Maximum number of reflow processes
Maximum chlorine content of rosin flux (% mass)
Peak temperature (molten solder temperature)
Time at peak temperature
Preheating temperature (package surface temperature) : 120°C or below
Maximum number of flow processes
Maximum chlorine content of rosin flux (% mass)
Peak temperature (pin temperature)
Soldering time (per side of device)
Maximum chlorine content of rosin flux (% mass)
Data Sheet PU10443EJ1V0DS
Soldering Conditions
CC
pin.
: 260°C or below
: 10 seconds or less
: 60 seconds or less
: 120±30 seconds
: 3 times
: 0.2%(Wt.) or below
: 215°C or below
: 25 to 40 seconds
: 30 to 60 seconds
: 3 times
: 0.2%(Wt.) or below
: 260°C or below
: 10 seconds or less
: 1 time
: 0.2%(Wt.) or below
: 350°C or below
: 3 seconds or less
: 0.2%(Wt.) or below
µ
PC2745TB,
Condition Symbol
µ
WS260
VP215
HS350
For soldering
IR260
PC2746TB