STEVAL-TDR001V1 STMicroelectronics, STEVAL-TDR001V1 Datasheet - Page 14

• Manufacturer Part Number: STEVAL-TDR001V1
• Description: BOARD EVAL AB-54003L-512
• Manufacturer: STMicroelectronics
• Type: Amplifierr

Specifications of STEVAL-TDR001V1

• Frequency: 380MHz ~ 512MHz
• For Use With/related Products: AB-54003L-512
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 497-6456

Package mechanical data
6.2
14/18
Thermal pad and via design SOT-89
Thernal vias are required in the PCB layout to effectively conduct heat away from the
package. The via pattern has been designed to address thermal, power dissipation and
electrical requirements of the device.
The via pattern is based on thru-hole vias with 0.203 mm to 0.330 mm finished hole size on
a 0.5 mm to 1.2 mm grid pattern with 0.025 plating on via walls. If micro vias are used in a
design, it is suggested that the quantity of vias be increased by a 4:1 ratio to achieve similar
results.
Figure 13. Pad layout details
Doc ID 17336 Rev 1
STEVAL-TDR001V1