STEVAL-TDR009V1 STMicroelectronics, STEVAL-TDR009V1 Datasheet - Page 9

• Manufacturer Part Number: STEVAL-TDR009V1
• Description: BOARD DEMO RF FM RADIO XMITTER
• Manufacturer: STMicroelectronics
• Type: Amplifierr

Specifications of STEVAL-TDR009V1

• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

STEVAL-TDR009V1
6
6.1
6.2
Table 4.
Package
M174
M174
M177
M244
(Moly
Type
disk)
0.500 dia 4l non
0.500 dia 4l non
0.550 dia 4l non
2 x 0.400x0.425
wide 2l lap n/h
herm w/flange
herm w/flange
herm w/flange
Description
SD2932 mounting recommendations
Mounting recommendations
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Mounting sequence
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DMOS packages - list of materials
(moly disk)
flange
Ensure holes in heatsinks are free from burrs;
Minimum depth of tapped holes in heatsinks is 6 mm;
Use 4-40 UNC-2A cheese-head screws with a flat washer to spread the joint pressure;
The minimum flatness of the mounting area is 0.02 mm;
Mounting area roughness should be less than 0.5 µm (micro);
Avoid, as much as possible, use of flux or flux solutions because flux can penetrate
even when hermetically sealed ceramic-capped transistors. Tin and wash the printed-
circuit board BEFORE mounting the power transistors, then solder the transistor leads
without using flux;
Transistor leads may be tinned by dipping them full-length into a solder bath at a
temperature of about 230 °C. No flux should be used during tinning;
Recommended heatsink compounds: WPSII (silicon free) from Austerlitz Electronics,
340 from dow corning etc.
Apply a thin layer of evenly distributed heatsink compound to the flange;
Position the device with flat washers in place;
Tighten the screws until finger tight (0.05 Nm);
Further tighten the screws until the specified torque is reached;
For M174, M177 and M244 type of packages, torque should be minimum 0.6 Nm and
0.75 Nm max.
W (85%)
Cu-Mo-
Cu-Mo-
Flange
(15%)
- Cu
Cu
Cu
Cu
Leadframe
Alloy 42
Alloy 42
Alloy 42
Alloy 42
(Fe58 /
(Fe58 /
(Fe58 /
(Fe58 /
Ni42)
Ni42)
Ni42)
Ni42)
insulator
BeO(99.5
Ceramic
(99.5%
(99.5%
(99.5%
% min)
BeO
BeO
BeO
min)
min)
min)
min / 350 µ max)
min / 350 µ max)
min / 350 µ max)
min / 350µ max)
Au (100 µ min)
Au (100 µ min)
over Ni (100 µ
over Ni (100 µ
over Ni (100 µ
over Ni (100 µ
Au (60 µ min)
Au (60 µ min)
Leads
SD2932 mounting recommendations
Plating
min / 350µ max)
min / 350µ max)
Ni(100 µ min) +
Ni(100 µ min) +
Au (100 µ min)
over Ni (100 µ
over Ni (100 µ
Pd (10 µ min)
Pd (10 µ min)
Au (60 µ min)
Flange
Torque (Nm)
Min
0.6
0.6
0.6
0.6
Max
0.75
0.75
0.75
0.75
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