UGWKPA8VEA1-EK Unigen Corp, UGWKPA8VEA1-EK Datasheet - Page 33

• Manufacturer Part Number: UGWKPA8VEA1-EK
• Description: EVALUATION KIT PAN 800
• Manufacturer: Unigen Corp
• Series: PANr
• Type: Transceiver, UHFr

Specifications of UGWKPA8VEA1-EK

• For Use With/related Products: PAN 800
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 784-1043

Solutions for a Real Time World
P
Manual Assembly
Automated Assembly
Re-Tek - 1533
94539
[e-mail]
http://www.unigen.com
RODUCTION
• PAN modules that are formed into a hybrid surface mount package which allows both
• PAN modules contain discrete components, therefore the assembly procedures utilized by
• Unigen recommends proper ESD procedures.
• The primary mounting surface for the module is located on the bottom pad surface.
• Castellations have been provided that run perpendicular to the pad surface beneath. This
• It is recommended that the user carefully align and tack one corner of the module then
• The end user layout pads should extend out slightly from the module to allow a fine tip
• Use a fine point conical tip to heat the modules castellation and board pad simultaneously.
• Apply .020 solder wire to the pad where the castellation contacts. The solder will wick
• Modules have been designed to be compatible with techniques utilized in an automated
• Due to the complexity of the module, additional attention is required in comparison to
• The reflow temperature profile is a critical point for creating a consistent solder connection.
• Any shock that may be applied during the reflow movement process should be avoided.
• If a shock is applied during the liquefied state of reflow, the components may shift causing
manual and automated placement.
automated or manual techniques are critical for the performance after installation on the
end users product.
design allows for proper heat transfer and solder wicking to the bottom side.
move sequentially around the module.
soldering iron to heat the pad and castellation simultaneously.
properly to the underlying surface providing a secure electrical connection.
process.
other component types.
malfunction of the module.
G
UIDELINES
PAN 433/868/902 MHz - UGW3S
Copyright Unigen Corporation, 2008
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Datasheet