LT5521EUF Linear Technology, LT5521EUF Datasheet - Page 15

• Manufacturer Part Number: LT5521EUF
• Description: IC MIXER HI LIN 3.7GHZ 16-QFN
• Manufacturer: Linear Technology
• Series: LT5521r

Specifications of LT5521EUF

• Rf Type: Cellular, PHS, UMTS, WCDMA
• Frequency: 10MHz ~ 3.7GHz
• Number Of Mixers: 1
• Gain: -0.5dB
• Noise Figure: 12.5dB
• Secondary Attributes: Up Converter
• Current - Supply: 98mA
• Voltage - Supply: 3.15 V ~ 5.25 V
• Package / Case: 16-WQFN Exposed Pad
• Operating Temperature (min): -40C
• Operating Temperature (max): 85C
• Operating Temperature Classification: Industrial
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

APPLICATIO S I FOR ATIO
4.35 0.05
PACKAGE DESCRIPTIO
2.90 0.05
2.15 0.05
(4 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
U
U
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
0.65 BSC
W
0.30 0.05
U
0.72 0.05
PACKAGE
OUTLINE
Figure 17. Top View of Demo Board
16-Lead Plastic QFN (4mm 4mm)
(Reference LTC DWG # 05-08-1692)
U
NOTE:
1. DRAWING CONFORMS TO JEDEC PACKAGE OUTLINE MO-220 VARIATION (WGGC)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
ON THE TOP AND BOTTOM OF PACKAGE
PIN 1
TOP MARK
(NOTE 6)
UF Package
4.00 0.10
(4 SIDES)
0.75 0.05
2.15 0.10
(4-SIDES)
0.200 REF
0.00 – 0.05
R = 0.115
BOTTOM VIEW—EXPOSED PAD
TYP
15
LT5521
16
0.65 BSC
15
0.30 0.05
0.55 0.20
1
2
(UF) QFN 1103
5521f