MICRF002YM Micrel Inc, MICRF002YM Datasheet - Page 13
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MICRF002YM
Manufacturer Part Number
MICRF002YM
Description
IC ASK RCVR RF/IF SHUTDWN 16SOIC
Manufacturer
Micrel Inc
Datasheet
1.MICRF002YM.pdf
(17 pages)
Specifications of MICRF002YM
Frequency
300MHz ~ 440MHz
Sensitivity
-95dBm
Data Rate - Maximum
10 kbps
Modulation Or Protocol
ASK, OOK
Applications
RKE
Current - Receiving
2.2mA
Data Interface
PCB, Surface Mount
Antenna Connector
PCB, Surface Mount
Features
Automatic Tuning
Voltage - Supply
4.75 V ~ 5.5 V
Operating Temperature
-40°C ~ 85°C
Package / Case
16-SOIC (0.154", 3.90mm Width)
Receiving Current
3.2mA
Data Rate
10Kbps
Modulation Type
ASK, OOK
Frequency Range
300MHz To 440MHz
Sensitivity Dbm
-97dBm
Rf Ic Case Style
SOIC
No. Of Pins
16
Operating Band Frequency
300 to 440MHz
Operating Temperature (min)
-40C
Operating Temperature (max)
85C
Operating Temperature Classification
Industrial
Operating Supply Voltage (min)
4.75V
Operating Supply Voltage (typ)
5V
Operating Supply Voltage (max)
5.5V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Memory Size
-
Lead Free Status / Rohs Status
Compliant
Other names
576-1332
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MICRF002YM
Manufacturer:
MICREL
Quantity:
475
Part Number:
MICRF002YM
Manufacturer:
MICREL/麦瑞
Quantity:
20 000
Company:
Part Number:
MICRF002YMTR
Manufacturer:
MICREL
Quantity:
5 140
C
Figure 3 illustrates the C
control voltage is developed as an integrated current into a
capacitor C
the decay current is a 1/10th scaling of this, nominally
1.5µA, making the attack/decay time constant ratio a fixed
10:1. Signal gain of the RF/IF strip inside the IC diminishes
as the voltage at C
attack/decay ratio is possible by adding resistance from the
C
Both the push and pull current sources are disabled during
shutdown, which maintains the voltage across C
improves recovery time in duty-cycled applications. To
further improve duty-cycle recovery, both push and pull
currents are increased by 45 times for approximately 10ms
after release of the SHUT pin. This allows rapid recovery of
any voltage droop on C
DO and WAKEB Pins
The output stage for DO (digital output) and WAKEB
(wakeup output) is shown in Figure 4. The output is a 10µA
push and 10µA pull switched-current stage. This output
stage is capable of driving CMOS loads. An external buffer-
Micrel, Inc.
July 2008
AGC
AGC
pin to either V
Pin
Timout
AGC
Compa-
rator
Figure 4. DO and WAKEB Pins
. The attack current is nominally 15µA, while
DDBB
Compa-
rator
Figure 3. CAGC Pin
1.5µA
AGC
15µA
AGC
or V
AGC
decreases. Modification of the
while in shutdown.
SSBB
VDDBB
VSSBB
pin interface circuit. The AGC
, as desired.
VDDBB
VSSBB
67.5µA
675µA
10µA
10µA
DO
CAGC
AGC
, and
13
driver is recommended for driving high-capacitance loads.
REFOSC Pin
The REFOSC input circuit is shown in Figure 5. Input
impedance is high (200kΩ). This is a Colpitts oscillator with
internal 30pF capacitors. This input is intended to work with
standard ceramic resonators connected from this pin to the
V
frequency accuracy is required. The nominal dc bias
voltage on this pin is 1.4V.
SEL0, SEL1, SWEN, and SHUT Pins
Control input circuitry is shown in Figures 6a and 6b. The
standard input is a logic inverter constructed with minimum
geometry MOSFETs (Q2, Q3). P-channel MOSFET Q1 is
a large channel length device which functions essentially
as a “weak” pullup to V
leading to an impedance to the V
1MΩ.
SSBB
pin, although a crystal may be used when greater
Figure 6a. SEL0, SEL1, SWEN Pins
SWEN
SHUT
SHUT
SEL0,
SEL1,
REFOSC
Figure 5. REFOSC Pin
VSSBB
VSSBB
Figure 6b. SHUT Pin
30pF
30pF
VDDBB
VDDBB
DDBB
VSSBB
Q1
Q1
Q4
. Typical pull-up current is 5µA,
Active
Bias
250
VSSBB
VSSBB
200k
Q2
Q3
Q2
Q3
30µA
DDBB
to Internal
Circuits
to Internal
Circuits
VDDBB
VSSBB
MICRF002/RF022
supply of typically
M9999-070808