TEA5768HL2FE ST-Ericsson Inc, TEA5768HL2FE Datasheet - Page 33

• Manufacturer Part Number: TEA5768HL2FE
• Description: IC FM STEREO LOW POWER 32LQFP
• Manufacturer: ST-Ericsson Inc

Specifications of TEA5768HL2FE

• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -
• Package / Case: -
• Voltage - Supply: -
• Frequency: -
• Operating Temperature: -
• Applications: -
• Sensitivity: -
• Memory Size: -
• Data Interface: -
• Data Rate - Maximum: -
• Modulation Or Protocol: -
• Antenna Connector: -
• Current - Receiving: -
• Other names: TEA5768HLBD; TEA5768HLBD

Philips Semiconductors
16.5
Notes
1. For more detailed information on the BGA packages refer to the “(LF)BGA Application Note ” (AN01026); order a copy
2. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
3. These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account
4. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder
5. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction.
6. Wave soldering is suitable for LQFP, TQFP and QFP packages with a pitch (e) larger than 0.8 mm; it is definitely not
7. Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than
8. Hot bar or manual soldering is suitable for PMFP packages.
2003 Nov 06
BGA, LBGA, LFBGA, SQFP, SSOP-T
DHVQFN, HBCC, HBGA, HLQFP, HSQFP, HSOP, HTQFP,
HTSSOP, HVQFN, HVSON, SMS
PLCC
LQFP, QFP, TQFP
SSOP, TSSOP, VSO, VSSOP
PMFP
Low-power FM stereo radio for
handheld applications
from your Philips Semiconductors sales office.
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods” .
be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature
exceeding 217 C
must be kept as low as possible.
cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side,
the solder might be deposited on the heatsink surface.
The package footprint must incorporate solder thieves downstream and at the side corners.
suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
(5)
Suitability of surface mount IC packages for wave and reflow soldering methods
(8)
, SO, SOJ
10 C measured in the atmosphere of the reflow oven. The package body peak temperature
PACKAGE
(3)
(1)
, TFBGA, VFBGA
33
not suitable
not suitable
suitable
not recommended
not recommended
not suitable
WAVE
(4)
SOLDERING METHOD
(5)(6)
(7)
Preliminary specification
suitable
suitable
suitable
suitable
suitable
not suitable
TEA5768HL
REFLOW
(2)