UPG2157T5F-A CEL, UPG2157T5F-A Datasheet - Page 7
![IC SWITCH MMIC SPDT 12-QFN](/photos/14/18/141864/upg2157t5f-a_sml.jpg)
UPG2157T5F-A
Manufacturer Part Number
UPG2157T5F-A
Description
IC SWITCH MMIC SPDT 12-QFN
Manufacturer
CEL
Datasheet
1.UPG2157T5F-EVAL-A.pdf
(10 pages)
Specifications of UPG2157T5F-A
Rf Type
802.11a/b/g/Wi-Fi, 802.16/WiMax, WLAN
Frequency
2.3GHz ~ 2.7GHz
Features
SPDT
Package / Case
12-QFN
Insertion Loss
0.60 dB to 0.80 dB
Mounting Style
SMD/SMT
Off Isolation (typ)
20 dB to 28 dB
Operating Frequency
2.3 GHz to 5.85 GHz
Switch Configuration
SPDT
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
RECOMMENDED SOLDERING CONDITIONS
methods and conditions other than those recommended below, contact your nearby sales office.
Infrared Reflow
Wave Soldering
Partial Heating
Caution Do not use different soldering methods together (except for partial heating).
This product should be soldered and mounted under the following recommended conditions.
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Peak temperature (package surface temperature)
i T
Time at temperature of 220°C or higher
Preheating time at 120 to 180°
Maximum number of reflow processes
Maximum chlorine content of rosin flux (% mass)
Peak temperature (molten solder temperature)
i T
Preheating temperature (package surface temperature) : 120°C or below
Maximum number of flow processes
Maximum chlorine content of rosin flux (% mass)
Peak temperature (terminal temperature)
Soldering time (per side of device)
Maximum chlorine content of rosin flux (% mass)
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Data Sheet PG10641EJ02V0DS
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: 260°C or below
:
: 60 seconds or less
:
: 3 times
: 0.2%(Wt.) or below
: 260°C or below
:
: 1 time
: 0.2%(Wt.) or below
: 350°C or below
: 3 seconds or less
: 0.2%(Wt.) or below
1
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0
2
0
0
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±30 seconds
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PG2157T5F
WS260
t i
HS350
For soldering
IR260
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