SI4712-B30-GM Silicon Laboratories Inc, SI4712-B30-GM Datasheet - Page 38

• Manufacturer Part Number: SI4712-B30-GM
• Description: IC TX FM RADIO W/RPS 20UQFN
• Manufacturer: Silicon Laboratories Inc

Specifications of SI4712-B30-GM

• Frequency: 76MHz ~ 108MHz
• Applications: General Purpose
• Modulation Or Protocol: FM
• Current - Transmitting: 18.8mA
• Data Interface: PCB, Surface Mount
• Antenna Connector: PCB, Surface Mount
• Voltage - Supply: 2.7 V ~ 5.5 V
• Operating Temperature: -20°C ~ 85°C
• Package / Case: 20-UQFN, 20-µQFN
• Operating Supply Voltage (typ): 3.3/5V
• Operating Supply Voltage (min): 2.7V
• Operating Supply Voltage (max): 5.5V
• Operating Temp Range: -20C to 85C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 20
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -
• Power - Output: -
• Memory Size: -
• Data Rate - Maximum: -
• Lead Free Status / Rohs Status: Supplier Unconfirmed

Si4712/13-B30
38
Notes: General
Note: Solder Mask Design
Notes: Stencil Design
Notes: Card Assembly
Symbol
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. Dimensioning and tolerancing is per the ANSI Y14.5M-1994 specification.
3. This land pattern design is based on IPC-SM-782 guidelines.
4. All dimensions shown are at Maximum Material Condition (MMC). Least Material
1. All metal pads are to be non-solder-mask-defined (NSMD). Clearance between the
1. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should
2. The stencil thickness should be 0.125 mm (5 mils).
3. The ratio of stencil aperture to land pad size should be 1:1 for the perimeter pads.
4. A 1.45 x 1.45 mm square aperture should be used for the center pad. This provides
1. A No-Clean, Type-3 solder paste is recommended.
2. The recommended card reflow profile is per the JEDEC/IPC J-STD-020C
GD
D2
E2
D
E
e
f
Condition (LMC) is calculated based on a fabrication allowance of 0.05 mm.
solder mask and the metal pad is to be 60 mm minimum, all the way around the pad.
be used to assure good solder paste release.
approximately 70% solder paste coverage on the pad, which is optimum to assure
correct component standoff.
specification for small body components.
1.60
1.60
2.10
Min
Table 20. PCB Land Pattern Dimensions
Millimeters
2.71 REF
0.50 BSC
2.71 REF
2.53 BSC
Max
1.80
1.80
—
Rev. 1.1
Symbol
GE
ZD
ZE
W
X
Y
2.10
Min
—
—
—
—
Millimeters
0.61 REF
Max
0.34
0.28
3.31
3.31
—