LRI64-SBN18/1GE STMicroelectronics, LRI64-SBN18/1GE Datasheet - Page 42
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LRI64-SBN18/1GE
Manufacturer Part Number
LRI64-SBN18/1GE
Description
IC EEPROM MEMORY TAG WAFER
Manufacturer
STMicroelectronics
Series
LRI64r
Datasheet
1.LRI64-W41GE.pdf
(49 pages)
Specifications of LRI64-SBN18/1GE
Rf Type
Write Once Read Many (WORM)
Frequency
13.56MHz
Features
ISO15693, ISO18000-3
Package / Case
Wafer
For Use With
497-5538 - DEMO KIT LONG-RANGE
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Package mechanical data
21
42/49
Package mechanical data
In order to meet environmental requirements, ST offers the LRI64 in ECOPACK
These packages have a Lead-free second-level interconnect. The category of second-level
interconnect is marked on the package and on the inner box label, in compliance with
JEDEC Standard JESD97.
The maximum ratings related to soldering conditions are also marked on the inner box label.
ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.
Figure 39. UFDFPN8 (MLP8) 8-lead ultra thin fine pitch dual flat package no lead
1. Drawing is not to scale.
Table 15.
1. Values in inches are converted from mm and rounded to 4 decimal digits.
2. Applied for exposed die paddle and terminals. Exclude embedding part of exposed die paddle from
Symbol
ddd
measuring.
D2
A1
E2
L1
L3
A
D
E
b
e
L
(2)
2 × 3 mm, package outline
UFDFPN8 (MLP8) 8-lead ultra thin fine pitch dual flat package no lead
2 × 3 mm, package mechanical data
0.55
0.02
0.25
0.45
Typ
1.6
0.2
0.5
2
3
A
E
A1
millimeters
0.45
0.08
Min
0.2
1.9
1.5
2.9
0.1
0.4
0.3
0
-
D
Max
0.05
0.15
0.6
0.3
2.1
1.7
3.1
0.3
0.5
-
ddd
L3
0.0217
0.0008
0.0098
0.0787
0.1181
0.0079
0.0197
0.0177
0.063
Typ
D2
e
b
UFDFPN-01
inches
L1
E2
L
0.0177
0.0079
0.0748
0.0591
0.1142
0.0039
0.0157
0.0118
0.0031
Min
0
-
(1)
®
packages.
0.0236
0.0118
0.0827
0.0669
0.0118
0.0197
0.0059
0.002
0.122
Max
-
LRI64