FA38SA50LC Vishay, FA38SA50LC Datasheet

MOSFET N-CH 500V 38A SOT-227

FA38SA50LC

Manufacturer Part Number
FA38SA50LC
Description
MOSFET N-CH 500V 38A SOT-227
Manufacturer
Vishay
Series
HEXFET®r
Datasheet

Specifications of FA38SA50LC

Fet Type
MOSFET N-Channel, Metal Oxide
Fet Feature
Standard
Rds On (max) @ Id, Vgs
130 mOhm @ 23A, 10V
Drain To Source Voltage (vdss)
500V
Current - Continuous Drain (id) @ 25° C
38A
Vgs(th) (max) @ Id
4V @ 250µA
Gate Charge (qg) @ Vgs
420nC @ 10V
Input Capacitance (ciss) @ Vds
6900pF @ 25V
Power - Max
500W
Mounting Type
Chassis Mount
Package / Case
SOT-227, miniBLOC
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Other names
*FA38SA50LC
VS-FA38SA50LC
VS-FA38SA50LC
VSFA38SA50LC
VSFA38SA50LC

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
FA38SA50LC
Manufacturer:
ST
0
Absolute Maximum Ratings
Thermal Resistance
Description
Third Generation HEXFETs from International Rectifier
provide the designer with the best combination of fast
switching, ruggedized device design, low on-resistance
and cost-effectiveness.
The SOT-227 package is universally preferred for all
commercial-industrial applications at power dissipation
levels to approximately 500 watts.
resistance of the SOT-227 contribute to its wide acceptance
throughout the industry.
www.irf.com
R
R
I
I
I
P
V
E
I
E
dv/dt
T
T
V
D
D
DM
AR
J
STG
ISO
D
GS
AS
AR
@ T
@ T
JC
CS
Fully Isolated Package
Easy to Use and Parallel
Dynamic dv/dt Rating
Fully Avalanche Rated
Simple Drive Requirements
Low Drain to Case Capacitance
Low Internal Inductance
@T
Low On-Resistance
C
C
C
= 25°C
= 100°C
= 25°C
Junction-to-Case
Case-to-Sink, Flat, Greased Surface
Continuous Drain Current, V
Continuous Drain Current, V
Pulsed Drain Current
Power Dissipation
Linear Derating Factor
Gate-to-Source Voltage
Single Pulse Avalanche Energy
Avalanche Current
Repetitive Avalanche Energy
Peak Diode Recovery dv/dt
Operating Junction and
Storage Temperature Range
Insulation Withstand Voltage (AC-RMS)
Mounting torque, M4 srew
Parameter
Parameter
The low thermal
GS
GS
@ 10V
@ 10V
G
Typ.
0.05
–––
S
D
FA38SA50LC
HEXFET
-55 to + 150
(1.3N•M)
Max.
500
± 20
S O T -2 2 7
150
580
4.0
2.5
38
24
38
50
16
®
R
V
DS(on)
Power MOSFET
DSS
Max.
0.25
I
–––
D
= 38A
= 500V
= 0.13
PD - 91615B
Units
Units
°C/W
W/°C
V/ns
mJ
mJ
kV
W
°C
A
A
V
1
2/2/99

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FA38SA50LC Summary of contents

Page 1

... Operating Junction and J T Storage Temperature Range STG V Insulation Withstand Voltage (AC-RMS) ISO Mounting torque, M4 srew Thermal Resistance Parameter R Junction-to-Case JC R Case-to-Sink, Flat, Greased Surface CS www.irf.com FA38SA50LC HEXFET The low thermal @ 10V GS @ 10V GS Typ. ––– 0. 91615B ® Power MOSFET V = 500V ...

Page 2

... FA38SA50LC Electrical Characteristics @ T Parameter V Drain-to-Source Breakdown Voltage (BR)DSS Breakdown Voltage Temp. Coefficient (BR)DSS J R Static Drain-to-Source On-Resistance DS(on) V Gate Threshold Voltage GS(th) g Forward Transconductance fs I Drain-to-Source Leakage Current DSS Gate-to-Source Forward Leakage I GSS Gate-to-Source Reverse Leakage Q Total Gate Charge g Q Gate-to-Source Charge ...

Page 3

... TOP BOTTOM 100 Fig 2. Typical Output Characteristics 3 2.5 2.0 1.5 1.0 0.5 = 50V 0.0 -60 -40 - Fig 4. Normalized On-Resistance FA38SA50LC VGS 15V 10V 8.0V 7.0V 6.0V 5.5V 5.0V 4.5V 4.5V 20µs PULSE WIDTH ° 150 Drain-to-Source Voltage (V) DS 38A V = 10V GS ...

Page 4

... FA38SA50LC 16000 1MHz iss 14000 rss oss ds gd 12000 10000 C iss 8000 6000 C oss 4000 C rss 2000 Drain-to-Source Voltage (V) DS Fig 5. Typical Capacitance Vs. Drain-to-Source Voltage 1000 100 T = 150 C ° ° 0.1 0.2 0.4 0.6 0.8 1.0 V ,Source-to-Drain Voltage (V) SD Fig 7. Typical Source-Drain Diode ...

Page 5

... Fig 11. Maximum Effective Transient Thermal Impedance, Junction-to-Case www.irf.com 10V Pulse Width Duty Factor Fig 10a. Switching Time Test Circuit d(on) Fig 10b. Switching Time Waveforms Notes: 1. Duty factor Peak 0.001 0. Rectangular Pulse Duration (sec) 1 FA38SA50LC D.U. µ d(off thJC C 0 ...

Page 6

... FA38SA50LC . Fig 12a. Unclamped Inductive Test Circuit Fig 12b. Unclamped Inductive Waveforms 6 1200 1000 D RIV E R 800 + - 600 A 400 200 Starting T , Junction Temperature ( C) Fig 12c. Maximum Avalanche Energy I D TOP 17A 24A BOTTOM 38A 50 75 100 125 ° J Vs. Drain Current www ...

Page 7

... Driver same type as D.U.T. I controlled by Duty Factor "D" SD D.U.T. - Device Under Test Period D = P.W. Waveform SD Body Diode Forward Current di/dt Waveform DS Diode Recovery dv/dt Body Diode Forward Drop Ripple for Logic Level Devices Fig 13. For N-Channel HEXFETS FA38SA50LC + + P.W. Period V =10V * ...

Page 8

... FA38SA50LC SOT-227 Package Details . Tube QUANTITY PER SREW AND W ASHE R IN CLUDED WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, Tel: (310) 322 3331 IR GREAT BRITAIN: Hurst Green, Oxted, Surrey RH8 9BB, UK Tel 1883 732020 IR GERMANY: Saalburgstrasse 157, 61350 Bad Homburg Tel 6172 96590 IR FAR EAST: K& ...

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