MS5540-CM Measurement Specialties Inc., MS5540-CM Datasheet - Page 17

• Manufacturer Part Number: MS5540-CM
• Description: MODULE BAROMETER MINITURE SENSOR
• Manufacturer: Measurement Specialties Inc.

Specifications of MS5540-CM

• Pressure Type: Absolute
• Operating Pressure: 0.15 ~ 0.16 PSI, 10 ~ 1100 mbar
• Output: Digital
• Voltage - Supply: 2.2 V ~ 3.6 V
• Termination Style: PCB
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 6.2 x 6.4mm Module
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 223-1098-2

ASSEMBLY
MECHANICAL STRESS
It is recommended to avoid mechanical stress on the PCB on which the sensor is mounted. The thickness of the
PCB should not be below 1.6 mm. A thicker PCB is stiffer creating less stress on the soldering contacts. For
applications where mechanical stress cannot be avoided (for example ultrasound welding of the case or thin
PCB’s in watches) please fix the sensor with drops of low stress epoxy (for example Hysol FP-4401).
MOUNTING
The MS5540C can be placed with automatic Pick&Place equipment using vacuum nozzles. It will not be
damaged by the vacuum. Due to the low stress assembly the sensor does not show pressure hysteresis effects.
Special care has to be taken to not touch the protective gel of the sensor during the assembly.
It is important to solder all contact pads. The Pins PEN and PV shall be left open or connected to VDD. Do not
connect the Pins PEN and PV to GND!
SEALING WITH O-RING
In products like outdoor watches the electronics must be protected against direct water or humidity. For those
products the MS5540C provides the possibility to seal with an O-ring. The protective cap of the MS5540C is
made of special anticorrosive and antimagnetic stainless steel with a polished surface. In addition to this the
MS5540C is filled with silicone gel covering the sensor and the bonding wires. The O-ring (or O-rings) shall be
placed at the outer diameter of the metal cap. This method avoids mechanical stress because the sensor can
move in vertical direction.
CLEANING
The MS5540C has been manufactured under cleanroom conditions. Each device has been inspected for the
homogeneity and the cleanness of the silicone gel. It is therefore recommended to assemble the sensor under
class 10’000 or better conditions. Should this not be possible, it is recommended to protect the sensor opening
during assembly from entering particles and dust. To avoid cleaning of the PCB, solder paste of type “no-clean”
shall be used. Cleaning might damage the sensor!
ESD PRECAUTIONS
The electrical contact pads are protected against ESD up to 4 kV HBM (human body model). It is therefore
essential to ground machines and personal properly during assembly and handling of the device. The MS5540C
is shipped in antistatic transport boxes. Any test adapters or production transport boxes used during the
assembly of the sensor shall be of an equivalent antistatic material.
DA5540C_001
February 20th, 2008
17
0005540C1193 ECN 1037