24-7068-7601 Kester Solder, 24-7068-7601 Datasheet
24-7068-7601
Specifications of 24-7068-7601
KE1137
Q2171296
24-7068-7601 Summary of contents
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RECOMMENDED Electronics Assembly Materials ...
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... Suggested Packaging Style Liquid Soldering Fluxes for Lead-Free Wave Soldering Lead-free wave and selective soldering require exposing the flux to slightly higher soldering temperatures. Lead-free alloys traditionally wet metal surfaces more slowly than tin-lead. Kester liquid fluxes for lead-free assembly have new activator packages to enable rapid wetting and hole-filling, ensuring reliable product output ...
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... K100LD Lead-Free Solder Bar K100LD is a new patent-pending low-cost lead-free solder alloy for use in wave soldering, selective soldering, and tip tinning operations. K100LD has the Lowest Copper Dissolution amongst all common solder alloys, including SN63, SAC305, and other lead-free options. ...
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... K100LD Kester Lead-Free 48 331 Water-Soluble 1.0% 1.25% 66 core (3.3%) IPC/J-STD-004 Flux designator ORH1 Diameter Core Size .020 66 24-7068-7603 .025 66 24-7068-7617 .031 66 24-7068-7601 .050 66 24-7068-7606 .062 66 24-7068-7607 Diameter Core Size .020 66 24-7068-1401 .025 66 24-7068-1406 .031 66 24-7068-1402 .050 66 24-7068-1404 .062 66 24-7068-1400 ...
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... Metal % Suggested 35g and 100g syringes Packaging Style *For lead based products, Kester produces solder powder to J-STD-006B for alloy purity and particle distribution, except for Antimony, which is specified to a maximum of 0.2%. Solder Paste for Stencil Printing Applications HydroMark 531 ® Easy Profile ...
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... Solder Paste Kester Part # Description 7002020510 Easy Profile 256HA No-Clean, Type 3, 90% metal ® Easy Profile 256HA No-Clean, Type 3, 90% metal 7002020310 ® 7002020511 Easy Profile 256HA No-Clean, Type 3, 90% metal ® Easy Profile 256HA No-Clean, Type 3, 90% metal 7002020311 ® ...
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... Sn60Pb40 1 2/3 lbs. 04-6040-0050 Kester Solder Analysis Program Kester's Solder Analysis Program is a prepaid method for rapid response solder sample analysis. It allows customers to document solder pot impurities for conformance to Federal Specifications or ISO quality requirements. Option C: This option includes monitoring tin, antimony, copper, gold, lead, cadmium, aluminum, zinc, iron, arsenic, bismuth, silver, and nickel ...
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... Solder Wire "245" No-Clean "245" halide-free; rosin based no-clean core flux that provides excellent wetting combined with optimal reliability and cosmetics. "245" is compliant to Bellcore GR-78-CORE and is classified as ROL0 per J-STD-004. “245” No-Clean Core 1 lb. Part # Alloy Diameter 24-6337-8806 Sn63Pb37 .015 Sn63Pb37 ...
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... No-Clean No-Clean 4.2 3. 1.015 1.012 Developed to reduce bottomside micro-solder balling and bridging. The wetting system is designed to allow for a larger process window and can survive the longer dwell times in extremely turbulent chip waves. Designed for spray applications. Telcordia Issue 1 GR-78-CORE & IPC/J-STD-004 ...
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... Water-Soluble 5 gallon 2331-ZX Water-Soluble 53 gallon drum 2235 Water-Soluble 1 gallon 2235 Water-Soluble 5 gallon 2235 Water-Soluble 53 gallon drum 2120 Water-Soluble 1 gallon 2120 Water-Soluble 5 gallon 2120 Water-Soluble 53 gallon drum 2120 Organic Water-Soluble 24 670 0.862 ± 0.005 Halide-Free IPC/J-STD-004 Flux designator ORH0 4662 ...
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... Kester Flux-Pen ® The Kester Flux-Pen ® unique tool for rework and touch-up soldering. It allows controlled application of flux, eliminating the mess from flux bottles. Flux-Pens are ideally suited for typical hand-soldering applications. The five available formulas are listed below. Kester Part # ...
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... Good control is necessary to assure a consistent amount of flux is applied to the circuit boards, consistent soldering results are obtained, and the least amount of flux residue remains after soldering. Kester PS-20 and PS-22 flux kits provide a simple method for process control. Kester Part # ...
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... Kester's TSFs are the industry standard for attachment of spheres to BGA and µBGA packages. The TSFs are also used in electronics assembly opera- tions to solder flip chip components to PWB substrates. Kester's TSF portfolio includes a complete line of no clean and water-soluble products capable of being screen and stencil printed, dot dispensed, or thin film transfer processed. ...
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... Solder Masks and Solderforms Kester Solder Masks TC-530 Peelable De-Ammoniated Solder Mask This high-temperature flexible solder masking compound can be applied to areas of printed circuit boards, which require masking during wave soldering processes. It can also be used on bare copper without causing oxidation. TC-530 is popular because of its low odor characteristics and can be used as a mold seal and conformal coat mask ...
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... EniviroMark™ 907, EnviroMark™ 828 186, 1544, 2120, Easy Profile 256 & 256HA ® 2331-ZX, 2235, 2224-25, HydroMark 531, TSF 6592LV, 2222, 2220-VF TSF 6800 Series Base metal must be plated. 2222, 2220-VF Call Kester's Customer Service Base metal must be plated ...
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... To achieve this we will focus on customer-driven innovation and exceptional service worldwide. ASIA-PACIFIC ASIA-PACIFIC HEADQUARTERS HEADQUARTERS Singapore Singapore 500 Chai Chee Lane Singapore 4690224 Phone: (+65) 6 449-1133 Fax: (+65) 6 242-9036 Email: customerservice@kester.com.sg Japan 20-11 YokoKawa 2-Chome, Sumida-ku Tokyo 130, Japan Tel: (+81) 3-3624-5351 Fax (+81) 3-3626-6253 Email: jpsales@kester.com.sg B ...