24-6337-8814 Kester Solder, 24-6337-8814 Datasheet

SOLDER NO-CLEAN 18AWG 63/37 1LB

24-6337-8814

Manufacturer Part Number
24-6337-8814
Description
SOLDER NO-CLEAN 18AWG 63/37 1LB
Manufacturer
Kester Solder
Series
245r
Type
Solder, No-Cleanr
Datasheets

Specifications of 24-6337-8814

Composition
Sn63Pb37 (63/37)
Melting Point
361°F (183°C)
Wire Gauge
18 Gauge - 1.1% Flux
Diameter
0.05" (1.27mm)
Alloy
Sn63Pb37
Diameter, Outer
0.050 in.
Weight
1 lbs.
Outer Diameter
0.05"
Solder Gauge Awg
18AWG
Solder Alloy
63/37 Sn/Pb
Melting Temperature
183°C
Flux Type
No Clean
External Diameter
0.05"
Peak Reflow Compatible (260 C)
No
Rohs Compliant
No
Flux Core Size No.
50
Flux Percent
1.1%
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
For Use With
Residue Flux for Cored Solder Wire
Other names
KE1402
Kester 245 No-clean Cored Wire was developed
to complement low residue liquid fluxes being used
by the electronics industry.
based on some of the same principles that have
been safely used for years in mildly activated rosin
fluxes.
results in visually acceptable assemblies without
cleaning, yet soldering quality and efficiency is
comparable to that obtained with mildly activated
rosin flux. Kester 245 was formerly classified as
Type LR per MIL-F-14256. Kester 245 is Bellcore
GR-78 compliant.
Performance Characteristics:
This product meets the requirements of the RoHS
(Restriction of Hazardous Substances) Directive,
2002/95/EC Article 4 for the stated banned
substances.
combined with a lead free alloy)
• Highly reliable post-soldering residue
• Minimal residue
• Compatible with leaded and lead-free alloys
• Classified as ROL0 per J-STD-004
• Compliant to Bellcore GR-78
The use of 245 No-clean Cored Wire
Product Description
RoHS Compliance
(Applies only if this core flux is
®
The chemistry is
No-Clean Cored W
No-Clean Cored W
245
245
Copper Mirror Corrosion: Low
Tested to J-STD-004, IPC-TM-650, Method 2.3.32
Corrosion Test: Low
Tested to J-STD-004, IPC-TM-650, Method 2.6.15
Silver Chromate: Pass
Tested to J-STD-004, IPC-TM-650, Method 2.3.33
Chloride and Bromides: None Detected
Tested to J-STD-004, IPC-TM-650, Method 2.3.35
Fluorides by Spot Test: Pass
Tested to J-STD-004, IPC-TM-650, Method 2.3.35.1
SIR, IPC (typical): Pass
Tested to J-STD-004, IPC-TM-650, Method 2.6.3.3
Spread Test (typical):
Tested to J-STD-004, IPC-TM-650, Method 2.4.46
Flux Core Solder
Plastic Rosin Core
285 Mildly Activated Rosin
245 No-Clean
Day 1
Day 4
Day 7
Reliability Properties
ire
ire
1.2 ×10
9.4 × 10
8.6 ×10
Blank
10
9
9
Area of Spread mm
194 (0.30)
335 (0.52)
348 (0.54)
Sn63Pb37
1.7 × 10
1.9 × 10
2.1 × 10
245
2
(in
9
9
9
2
)

24-6337-8814 Summary of contents

Page 1

... The use of 245 No-clean Cored Wire results in visually acceptable assemblies without cleaning, yet soldering quality and efficiency is comparable to that obtained with mildly activated rosin flux. Kester 245 was formerly classified as Type LR per MIL-F-14256. Kester 245 is Bellcore GR-78 compliant. Performance Characteristics: • Highly reliable post-soldering residue • ...

Page 2

... Sn62Pb36Ag02 alloys. Heat both the land area and component lead to be soldered with the iron prior to adding Kester 245 cored wire. Apply the solder wire to the land area or component lead. Do not apply the wire directly to the soldering iron tip. If needed, Kester 951 or 952-D6 no clean flux may be used as a compatible liquid flux to aid in reworking soldered joints ...