CSP-180-180 OKI METCAL, CSP-180-180 Datasheet - Page 2

• Manufacturer Part Number: CSP-180-180
• Description: NOZZLE CSP ID=18.0MM X 18.0MM
• Manufacturer: OKI METCAL

Specifications of CSP-180-180

• Tip - Type: Rework
• Tip - Size: CSP, 0.71" x 0.71" (18mm x 18mm)
• Tip - Shape: Quad
• For Use With/related Products: CSP Rework Systems
• Other names: CSP180180

leadership
Metcal. Your quality assurance
in Electronics Assembly Systems.
Over 50 years of experience in ongoing product development
and manufacturing position Metcal as a leader in electronics
assembly systems. Systems that assure our customers complete
process control.
Keeping with our commitment to be on the leading edge
of rapidly changing component technology, we now introduce
our redesigned Metcal BGA and CSP array package rework
systems.
These new models combine our extensive industry expertise with
our long-established relationships with technology leaders in the
computer, telecommunications and components industries.
These enhanced systems offer greater ease-of-use, and are cost
effective production systems with the flexibility to handle today’s
expanding range of components.
BGA
used to connect it to the circuit board, instead of peripheral leads as used with a
QFP or PLCC.
This enables the space under the device to be used, allowing
increased numbers of connections with reduced component sizes.
BGAs come in different forms such as PBGA (plastic package),
TBGA (tape carrier package) and CBGA (ceramic package).
These components are assembled using the normal surface
mount process. However, some components “float” on
eutectic solder balls, while other heavier components (such as
the ceramics) are supported by non-melt solder balls. These
factors may affect the subsequent rework process chosen.
CSP
nent whose overall size is no greater than 1.2 X the size of the
silicon die inside the component.” CSPs are generally smaller than BGAs and have a
typical ball pitch of between 0.5 and 1mm.
These parts are increasingly common on products where space is at a premium and the
ultimate volumes are expected to far exceed that of BGA. CSPs offer new challenges in
terms of accurate placement and material deposition during rework.
Flip Chip
down onto a substrate. This package offers the smallest possible component size, with
the fastest possible operating speeds. There are concerns to the protection of the die
and thermal stability after attachment. Normally, these components are encapsulated
or under-filled, making subsequent rework impossible.
Flip Chips are used predominantly in low-cost disposable consumer products or in
high speed (above 500 MHz) computing applications.
Chip Scale Package has been described as “a compo-
Ball Grid Array indicates an array of solder balls, underneath the component,
A bare silicon die that has solder bumps attached and is assembled face
What is an Array Package?
technology
www.metcal.com