D3SH-A0R1 Omron, D3SH-A0R1 Datasheet - Page 6
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D3SH-A0R1
Manufacturer Part Number
D3SH-A0R1
Description
SWITCH LVR SPST-NO RHT NO BOSS
Manufacturer
Omron
Series
D3SHr
Type
Surface Mount Detection Switchr
Specifications of D3SH-A0R1
Operating Force
24gf
Circuit
SPST-NO
Switch Function
Off-Mom
Contact Rating @ Voltage
0.001A @ 5VDC
Actuator Type
Angled Toggle (Detector)
Mounting Type
Surface Mount
Termination Style
SMD (SMT) Tab
Contact Form
SPST - NO
Contact Rating
1 mAmp
Actuator
Lever
Switch Terminals
Surface Mount
Contact Current Max
1mA
Contact Voltage Dc Nom
5V
Switch Operation
(ON)
External Height
0.9mm
External Width
3mm
External Depth
3.4mm
Pole Throw Configuration
SPST
Switch Function Configuration
N.O.
Current Rating (max)
0.001A
Operating Temp Range
-25C to 85C
Contact Configuration
SPST-NO
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
D3SHA0R1
SW1047TR
SW1047TR
Precautions
Be sure to read the precautions and information common to all Snap Action and Detection Switches, contained in the Technical User’s Guide,
“Snap Action Switches, Technical Information” for correct use.
■ Correct Use
Mounting
The cover has the same electrical potential as the COM terminal. Do not
short-circuit the cover with a NO or NC terminal when mounting the
cover.
Be careful of the following points. Incorrect handling may lead to
insufficient actuator return, Switch damage, or reduced durability.
A lubricant is used in the Switch. Some of the lubricant may seep out
because the Switch does not have an airtight construction. Consider
this possibility with respect to the usage conditions when designing
or using the Switch.
Application Environment
Do not use the Switch in locations that are subject to toxic gas, sili-
con, excessive dust, excessive dirt, high temperatures, high humidity,
sudden temperature changes, water splashes, or oil splashes.
Otherwise, damage resulting by faulty contact of the Switch contacts,
corrosion, or other causes, or other functional faults may occur.
Insulation and Wiring
Be sure that the installation conditions provide a sufficient insulation
distance between Switch terminals and other metal parts, lands, etc.
Cleaning
The Switch does not have an airtight construction, and it must not be
cleaned with cleaning fluids. Malfunctions may occur if the cleaning
fluid penetrates the interior of the Switch together with flux or foreign
matter from the surface of the PCB.
Confirmation with Actual Equipment
Be sure to confirm the quality of the product under the load and
environmental conditions that will be used during actual applications.
68
• Set the operating body in line with the direction of the actuator
• Set the Switch stroke to 70% to 100% of the overtravel (the differ-
• Do not subject the Switch to operations that involve strong impact.
• Do not use the Switch as a stopper.
• Do not apply excessive loads to the cover or operate the
• Do not use an adhesive to secure the Switch.
movement, and make sure that the operating body is completely
separate from the actuator when the Switch is in the free posi-
tion (FP). When the actuator is operated from the crosswise
direction of the Switch, make sure that the corner of the operat-
ing body has a minimum radius of R1.
ence between the operating position and the total travel position).
actuator from a direction other than a specified operating
direction.
Operating body
Surface Mount Detection Switch
cover
R1 min
D3SH
■ Caution
Electrical Ratings
Confirm the contact load in order to select an appropriate switch rat-
ing.
Do not apply an excessive electrical load to the contacts, otherwise
the contacts may weld, resulting in a short circuit or burning.
Terminal Connection
Do not use flow soldering or hand soldering to solder terminals.
Conduct reflow soldering within the range shown in the terminal tem-
perature profile below. Some reflow soldering devices have
extremely high peak values. Do a test in advance to confirm proper
soldering conditions.
Do not conduct reflow soldering more than twice. Also provide a time
interval of at least five minutes between the first and second reflow
soldering processes to allow the Switch to return to room tempera-
ture. Heating the Switch continuously (without an interval) may cause
the edges of the Switch to melt and degrade the characteristics.
When printing for a screen solder process, a 0.13-mm screen thick-
ness is recommended.
Be sure to provide local ventilation.
Printed Circuit Boards
Special attention must be paid to the handling of printed circuit
boards after a Switch has been mounted onto them. Airborne PCB
particles may penetrate the interior of the Switch when printed circuit
boards are separated by cutting. Also, do not stack printed circuit
boards that have Switches mounted on them.
Product Specification Details
This document provides only a partial list of specifications. It is rec-
ommended that you request complete drawings and specifications
prior to purchasing or using the product.
■ RoHS Directive Compliance
Models that are indicated as being RoHS compliant are free of the
following six substances.
Lead:
Mercury:
Cadmium:
Hexavalent chromium:
PBB:
PBDE:
255
220
150
MAX
Preheating time:
60 to 120 s
1,000 ppm max.
1,000 ppm max.
100 ppm max.
1,000 ppm max.
1,000 ppm max.
1,000 ppm max.
Heating time:
40 s max.