832C-375ML MG Chemicals, 832C-375ML Datasheet - Page 36

• Manufacturer Part Number: 832C-375ML
• Description: POTTING COMPOUND CLR 2PART 375ML
• Manufacturer: MG Chemicals
• Series: 832r
• Type: Potting Compound, 2 Partr

Specifications of 832C-375ML

• Product: Epoxy Compounds
• Size: 12 oz
• Chemical Component: Alkyl Glycidyl Ether/Epichlorohydrin and Biphenyl A
• Density, Vapor: Air
• Flash Point: 190
• Odor: Odorless
• Physical State: Liquid
• Primary Type: Adhesive
• Special Features: Kit
• Specific Gravity: 1.13
• Standards: RoHS Compliant
• Weight: 12 Oz.
• For Use With/related Products: Sealing Electronic Components
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 473-1083

34
MG Chemicals Product Catalog
Why do you need a Heat
Transfer Compound?
Improves thermal connections between
heat sinks and components.
Use Heat Transfer Compound on all electric and
electronic devices where efficient heat transfer
cooling through thermal coupling is required:
4Semiconductor mounting devices
4Thermal joints
4Ballast heat transfer mediums
4Power resistor mountings
4Thermocouple wells
4Transistor diodes
4Silicone rectifier base and mounting studs
This Non Silicone Heat Transfer Compound is designed
to eliminate the potential problems of silicone-based
compounds caused by migration and component con-
tamination. Designed for use in transferring heat away
from electrical and electronic devices such as transistors,
power diodes, semi-conductors, ballasts and thermo-
couple wells.
4High thermal conductivity
4High dielectric constant
4High dissipation factor
4Use with heat sinks or metal chassis
4Will not dry or harden
4Meets MIL-DTL-47113D
Available Sizes
Thermal Management
Non-Silicone
Heat Transfer Compound
8610
860
Catalog No.
860-4G
860-60G
860-150G
860-1P
860-1GAL
8610-60G
8610-1P
4g x 100 (0.14 oz x 100)
473 ml (1 pint)
473 ml (1 pint)
1 gal (20 lbs.)
150g (5.2 oz)
60g (2 oz)
60g (2oz)
Size
8610
Format
Singles
Tube
Pail
Tub
Tub
Tub
Tub
Specifications
Physical Properties
Appearance
Consistency
Specific Gravity@ 25°C (77°F)
Bleed % 24 hrs @200°C
Evaporation %24hrs @200°C
Dropping Point
Max. Operating Temp.
Electrical Properties
Thermal conductivity
Dielectric Strength (0.05 GAP)
Dielectric Constant (@ 1000 Hz) ASTM D-150
Dissipation Factor (@ 1000Hz)
Resistivity (Room Temp.)
Designed for use in transferring heat away from electrical
and electronic devices such as transistors, power diodes,
semi-conductors, ballasts and thermocouple wells.
Silicone
Heat Transfer Compound
How does a Heat Sink
Compound work?
Test Method
Visual
ASTM D-217
-
FTM-321
FTM-321
ASTM D-566
-
Hot Wire Method
Heat Flow #36°C
ASTM D-149
ASTM D-150
ASTM D-150
Contact Tech Support 1.800.201.8822
Non Silicone
Off White/Smooth Paste
300-320
2.0% max
> 500°F (260°C)
200°C (392°F)
18.48 x 10
(K Factor, Cal/Sec.cm°K)
350 V/mil
6.38 x 10
2.5 min.
1.0% max
4.4
0.0021
13
-4
ohm
•
cm
300°C (intermittent)
1.5 x 10
200°C (consistent)
860
0.657 W/m °K
White Paste
15
2.0% max
2.0% max
ohm
400 V/mil
300-320
Silicone
2.3 min
0.0032
•
3.81
cm