62-2324-2001-8 3M, 62-2324-2001-8 Datasheet - Page 3

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62-2324-2001-8

Manufacturer Part Number
62-2324-2001-8
Description
TAPE SCOTCH-WELD 4IN X 36YD
Manufacturer
3M
Series
Scotch-Weld™r
Datasheet

Specifications of 62-2324-2001-8

Tape Type
Film
Adhesive
Epoxy Thermosetting
Backing, Carrier
Crepe Paper
Thickness
0.0179" (17.9 mils, 0.455mm)
Thickness - Adhesive
0.0100" (10.0 mils, 0.254mm)
Thickness - Backing, Carrier, Liner
0.0079" (7.9 mils, 0.201mm)
Width
4.00" (101.60mm) 1/3'
Length
108' (32.9m) 36 yds
Color
White, Off
Usage
Bonding
Temperature Range
250°F (121°C) - 60 minutes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
Q5481988
Typical Overlap Shear
(OLS) Adhesions to
Various Substrates
3
Bonding Film
AF111 for Electronics Applications
Suggested Use
Procedure
(continued)
• OLS values given in psi (pounds per square inch). ASTM D1002.
• Al (aluminum), CRS (cold rolled steel), FR-4 (printed circuit board substrate), LCP (liquid
• Solvent wiped (MEK, alcohol)*; 3M™ Scotch-Brite™ Scour Pad (green) abraded; sanded
• OLS bonds were 1" x 0.5" and tested at 0.2"/minute.
• Bonds were cured 60 minutes (+ 7 minutes ramp time) at 250°F (121°C).
• The polyimide and polyester films were overbonded to CRS using 3M™ Scotch-Weld™
Application of Film to Substrate:
A. Cut a portion of film sufficient for the assembly from the stock roll with
B. Remove one liner and place the exposed adhesive against the substrate using the
C. Position film and rub out all air between the adhesive and the substrate. Use of a
D. Remove second protective liner.
E. Complete assembly and cure, being careful to avoid trapping air.
*Note: When using solvents, extinguish all ignition sources and follow the
Note: The following technical information and data should be considered representative
Substrate
Al (etched)
Al (sanded, solvent wiped)
Al (scour pad abraded, solvent wiped)
Al (solvent wiped)
CRS (scour pad abraded, solvent wiped)
Stainless Steel (solvent wiped)
FR-4 (solvent wiped)
LCP (solvent wiped)
Polyimide Film
Polyester Film
Black E-coat
Phenolic Board
Ultem
PEN Plastic
crystal polymer), and PEN (polyethylene naphthalate).
(600 grit sandpaper).
Epoxy Adhesive DP-190.
remaining liner as a protective cover.
protective liner in place. Note earlier comment to bring adhesive to room
temperature before use.
rubber roller will facilitate this process.
or typical only and should not be used for specification purposes.
®
1000
manufacturer’s precautions and directions for use.
- 3 -
3M™ Bonding Film AF111 OLS
5300 psi
3500 psi
3250 psi
3100 psi
2450 psi
1150 psi
1750 psi
1075 psi
1150 psi
1100 psi
450 psi
300 psi
650 psi
450 psi