MCP2004-E/P Microchip Technology, MCP2004-E/P Datasheet - Page 3

• Manufacturer Part Number: MCP2004-E/P
• Description: IC LIN BUS BIDIRECT 8PDIP
• Manufacturer: Microchip Technology

Specifications of MCP2004-E/P

• Maximum Operating Temperature: + 125 C
• Minimum Operating Temperature: - 40 C
• Mounting Style: Through Hole
• Operating Supply Voltage: 6 V to 27 V
• Package / Case: PDIP-8
• Supply Current: 90 uA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

1.0
The MCP2003/4 provides a physical interface between
a microcontroller and a LIN bus. This device will
translate the CMOS/TTL logic levels to LIN logic level,
and vice versa. It is intended for automotive and
industrial applications with serial bus speeds up to
20 Kbaud.
LIN specification 2.1 requires that the transceiver of all
nodes in the system is connected via the LIN pin, refer-
enced to ground and with a maximum external
termination resistance of 510 from LIN bus to battery
supply. The 510 corresponds to 1 master and
15 slave nodes.
The V
external voltage regulator. This pin is high in all modes
except for Power-Down mode.
1.1
1.1.1
An external reverse-battery-blocking diode should be
used to provide polarity protection (see
1.1.2
An external 43V transient suppressor (TVS) diode,
between V
protection resistor (R
supply and the V
power transients (see
While this protection is optional, it is considered good
engineering practice.
1.2
1.2.1
For component-level ESD ratings, please refer to the
maximum operation specifications.
1.2.2
The LIN Bus specification states that the LIN pin must
transition to the recessive state when ground is
disconnected. Therefore, a loss of ground effectively
forces the LIN line to a high-impedance level.
 2010 Microchip Technology Inc.
REN
DEVICE OVERVIEW
External Protection
Internal Protection
pin can be used to drive the logic input of an
REVERSE BATTERY PROTECTION
ESD PROTECTION
TRANSIENT VOLTAGE
PROTECTION (LOAD DUMP)
BB
GROUND LOSS PROTECTION
and ground, with a 50 transient
BB
pin serve to protect the device from
TP
Example
) in series with the battery
1-1) and ESD events.
Example
1-1).
1.2.3
The thermal protection circuit monitors the die
temperature and is able to shut down the LIN
transmitter.
There are two causes for a thermal overload. A thermal
shut down can be triggered by either, or both, of the
following thermal overload conditions.
• LIN bus output overload
• Increase in die temperature due to increase in
Driving the T
sible to determine whether there is a bus contention
(Rx = low, Tx = high) or a thermal overload condition
(Rx = high, Tx = low). After a thermal overload event,
the device will automatically recover once the die tem-
perature has fallen below the recovery temperature
threshold. See
FIGURE 1-1:
environment temperature
THERMAL PROTECTION
XD
Figure
and checking the R
Operation
Mode
1-1.
THERMAL SHUTDOWN
STATE DIAGRAM
Temp <
MCP2003/4
Shorted
to V
BB
SHUTDOWN
Transmitter
Shutdown
LIN bus
XD
TEMP
pin makes it pos-
DS22230C-page 3