NTMD6N03R2G ON Semiconductor, NTMD6N03R2G Datasheet - Page 2
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NTMD6N03R2G
Manufacturer Part Number
NTMD6N03R2G
Description
MOSFET PWR N-CH DL 6A 30V 8SOIC
Manufacturer
ON Semiconductor
Datasheet
1.NTMD6N03R2.pdf
(8 pages)
Specifications of NTMD6N03R2G
Fet Type
2 N-Channel (Dual)
Fet Feature
Logic Level Gate
Rds On (max) @ Id, Vgs
32 mOhm @ 6A, 10V
Drain To Source Voltage (vdss)
30V
Current - Continuous Drain (id) @ 25° C
6A
Vgs(th) (max) @ Id
2.5V @ 250µA
Gate Charge (qg) @ Vgs
30nC @ 10V
Input Capacitance (ciss) @ Vds
950pF @ 24V
Power - Max
2W
Mounting Type
Surface Mount
Package / Case
8-SOIC (0.154", 3.90mm Width)
Configuration
Dual Dual Drain
Transistor Polarity
N-Channel
Resistance Drain-source Rds (on)
0.032 Ohms
Forward Transconductance Gfs (max / Min)
10 S
Drain-source Breakdown Voltage
30 V
Gate-source Breakdown Voltage
+/- 20 V
Continuous Drain Current
6 A
Power Dissipation
2 W
Maximum Operating Temperature
+ 175 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 55 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
NTMD6N03R2GOS
NTMD6N03R2GOS
NTMD6N03R2GOSTR
NTMD6N03R2GOS
NTMD6N03R2GOSTR
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
NTMD6N03R2G
Manufacturer:
ON
Quantity:
2 500
Part Number:
NTMD6N03R2G
Manufacturer:
ON/安森美
Quantity:
20 000
3. Pulse Test: Pulse Width ≤ 300 ms, Duty Cycle ≤ 2%.
4. Switching characteristics are independent of operating junction temperature.
ELECTRICAL CHARACTERISTICS
OFF CHARACTERISTICS
ON CHARACTERISTICS (Note 3)
DYNAMIC CHARACTERISTICS
SWITCHING CHARACTERISTICS (Notes 3 & 4)
BODY−DRAIN DIODE RATINGS (Note 3)
Drain−to−Source Breakdown Voltage
Temperature Coefficient (Positive)
Zero Gate Voltage Drain Current
Gate−Body Leakage Current
Gate Threshold Voltage
Temperature Coefficient (Negative)
Static Drain−to−Source On−State Resistance
Forward Transconductance
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Turn−On Delay Time
Rise Time
Turn−Off Delay Time
Fall Time
Turn−On Delay Time
Rise Time
Turn−Off Delay Time
Fall Time
Gate Charge
Diode Forward On−Voltage
Reverse Recovery Time
Reverse Recovery Stored Charge
(I
(V
(V
(V
(V
(V
(V
(V
(V
S
GS
DS
DS
GS
DS
GS
GS
DS
= 5 A, dI
= 0 Vdc, I
= 24 Vdc, V
= 24 Vdc, V
= ±20 Vdc, V
= V
= 10 Vdc, I
= 4.5 Vdc, I
= 15 Vdc, I
GS
S
, I
/dt = 100 A/ms, V
D
D
= 250 mAdc)
D
D
D
= 250 mA)
GS
GS
= 6 Adc)
= 5.0 Adc)
DS
= 3.9 Adc)
= 0 Vdc, T
= 0 Vdc, T
= 0 Vdc)
Characteristic
GS
J
J
= 25°C)
= 125°C)
= 0 V)
(I
(T
S
C
= 1.7 Adc, V
(V
= 25°C unless otherwise noted)
(I
DS
(V
(V
S
(I
DD
DD
= 1.7 Adc, V
= 24 Vdc, V
dI
S
(V
V
S
= 5 A, V
= 15 Vdc, I
= 15 Vdc, I
f = 1.0 MHz)
V
V
GS
/dt = 100 A/ms)
DS
R
R
GS
GS
I
D
G
G
GS
= 10 Vdc,
= 15 Vdc,
= 5 A)
= 6 W)
= 4.5 V,
= 6 W)
= 10 V,
http://onsemi.com
= 0 V, T
GS
GS
GS
D
D
= 0 V,
= 0 Vdc,
= 1 A,
= 1 A,
= 0 V)
J
2
= 150°C)
V
Symbol
R
V
(BR)DSS
I
I
C
t
t
t
t
DS(on)
C
Q
GS(th)
C
V
g
DSS
GSS
d(on)
d(off)
d(on)
d(off)
Q
Q
Q
Q
t
FS
oss
t
t
rss
t
t
t
t
SD
iss
RR
rr
a
b
r
f
r
f
T
1
2
3
Min
1.0
30
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
0.024
0.030
0.015
Typ
0.75
0.62
680
210
1.8
4.6
30
10
70
2.4
5.0
4.3
22
45
45
13
27
22
34
19
26
11
15
−
−
−
−
9
0.032
0.040
Max
100
950
300
135
1.0
2.5
20
1.0
18
40
80
80
30
50
40
70
30
−
−
−
−
−
−
−
−
−
−
−
−
mV/°C
mV/°C
Mhos
mAdc
nAdc
Unit
Vdc
Vdc
Vdc
pF
nC
mC
W
ns
ns
ns