MCF51JE256VMB Freescale Semiconductor, MCF51JE256VMB Datasheet - Page 44

IC MCU 256K COLDF 81-PBGA

MCF51JE256VMB

Manufacturer Part Number
MCF51JE256VMB
Description
IC MCU 256K COLDF 81-PBGA
Manufacturer
Freescale Semiconductor
Series
MCF51JEr
Datasheet

Specifications of MCF51JE256VMB

Core Processor
Coldfire V1
Core Size
32-Bit
Speed
50MHz
Connectivity
CAN, EBI/EMI, I²C, SCI, SPI, USB OTG
Peripherals
LVD, PWM, WDT
Number Of I /o
48
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 3.6 V
Data Converters
A/D 12x12b, D/A 1x12b
Oscillator Type
External
Operating Temperature
-40°C ~ 105°C
Package / Case
81-LBGA
Core
ColdFire V1
Data Bus Width
32 bit
Data Ram Size
32 KB
Interface Type
SPI, SCI, I2C
Maximum Clock Frequency
50 MHz
Number Of Programmable I/os
48
Number Of Timers
2
Operating Supply Voltage
1.8 V to 3.6 V
Maximum Operating Temperature
+ 105 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
Package
81MAPBGA
Device Core
ColdFire
Family Name
MCF51JE
Maximum Speed
50.33 MHz
On-chip Adc
8-chx12-bit
On-chip Dac
1-chx12-bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
 Details

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MCF51JE256VMB
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
1
2
3
4
Preliminary Electrical Characteristics
3.14
This section provides details about program/erase times and program-erase endurance for the Flash
memory.
Program and erase operations do not require any special power sources other than the normal V
For more detailed information about program/erase operations, see the Memory chapter in the Reference
Manual for this device (MCF51JE256RM).
1-4
The frequency of this clock is controlled by a software setting.
These values are hardware state machine controlled. User code does not need to count cycles. This information supplied for calculating
approximate time to program and erase.
Typical endurance for flash was evaluated for this product family on the HC9S12Dx64. For additional information on how Freescale defines
typical endurance, please refer to Engineering Bulletin EB619, Typical Endurance for Nonvolatile Memory.
Typical data retention values are based on intrinsic capability of the technology measured at high temperature and de-rated to 25°C using the
Arrhenius equation. For additional information on how Freescale defines typical data retention, please refer to Engineering Bulletin EB618, Typical
Data Retention for Nonvolatile Memory.
10
#
1
2
3
4
5
6
7
8
9
Supply voltage for program/erase
-40°C to 105°C
Supply voltage for read operation
Internal FCLK frequency
Internal FCLK period (1/FCLK)
Byte program time (random location)
Byte program time (burst mode)
Page erase time
Mass erase time
Program/erase endurance
Data retention
T
T = 25°C
L
Flash Specifications
to T
H
= –40°C to + 105°C
4
Characteristic
2
2
1
3
2
2
Preliminary — Subject to Change
Table 24. Flash Characteristics
V
Symbol
prog/erase
V
f
t
t
t
t
t
t
FCLK
Burst
Mass
D_ret
Page
Fcyc
Read
prog
10,000
Min
150
1.8
1.8
15
5
100,000
Typical
20,000
4000
100
9
4
Max
6.67
200
3.6
3.6
Freescale Semiconductor
cycles
years
Unit
t
t
t
t
kHz
Fcyc
Fcyc
Fcyc
Fcyc
μs
V
V
DD
supply.
C
D
D
D
D
C
C
P
P
P
P

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