MCF51MM128VMB Freescale Semiconductor, MCF51MM128VMB Datasheet - Page 56

IC MCU 32BIT 128K COLDF 81-PBGA

MCF51MM128VMB

Manufacturer Part Number
MCF51MM128VMB
Description
IC MCU 32BIT 128K COLDF 81-PBGA
Manufacturer
Freescale Semiconductor
Series
MCF51MMr
Datasheet

Specifications of MCF51MM128VMB

Core Processor
Coldfire V1
Core Size
32-Bit
Speed
50MHz
Connectivity
CAN, EBI/EMI, I²C, SCI, SPI, USB OTG
Peripherals
LVD, PWM, WDT
Number Of I /o
48
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 3.6 V
Data Converters
A/D 8x16b, D/A 1x12b
Oscillator Type
External
Operating Temperature
-40°C ~ 105°C
Package / Case
81-LBGA
Core
ColdFire V1
Data Bus Width
32 bit
Data Ram Size
32 KB
Interface Type
SCI, SPI, I2C, USB
Maximum Clock Frequency
50.3 MHz
Operating Supply Voltage
1.8 V to 3.6 V
Maximum Operating Temperature
+ 105 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
 Details

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MCF51MM128VMB
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Revision History
4.3
Table 31
outline/mechanical drawings are available on the MCF51MM256/128 Product Summary pages at
http://www.freescale.com.
To view the latest drawing, either:
5
This section lists major changes between versions of the MCF51MM256 Data Sheet.
56
Freescale reserves the right to change the detail specifications as may be required to permit improvements in the design of its products.
Revision
Click on the appropriate link in
Open a browser to the Freescale
document number (from
0
1
2
3
4
provides the available package types and their document numbers. The latest package
Mechanical Drawings
Revision History
March/April 2009 Initial Draft
October 2010
April 2010
July 2009
July 2009
Date
• Revised to follow standard template.
• Removed extraneous headings from the TOC.
• Corrected units for Monotoncity to be blank in for the DAC specification.
• Updated ADC characteristic tables to include 16-Bit SAR in headings.
• Changed MCG (XOSC) Electricals Table - Row 2, Average Internal Reference
• Updated Thermal Characteristics table. Reinserted the 81 and 104 MapBGA devices.
• Revised the ESD and Latch-Up Protection Characeristic description to read: Latch-up
• Changed Table . DC Characteristics rows 2 and 4, to 1.8 V, ILoad = -600 mA
• Corrected the 16-bit SAR ADC Operating Condition table Ref Voltage High Min value
• Updated the ADC electricals.
• Inserted the Mini-FlexBus Timing Specifications.
• Added a Temp Drift parameter to the VREF Electrical Specifications.
• Removed the S08 Naming Convention diagram.
• Updated the Orderable Part Number Summary to include the Freescale Part Number
• Completed the Package Description table values.
• Changed the 80LQFP package drawing from 98ARL10530D to 98ASS23174W.
• Updated with the latest characteristic data. Added several figures. Added the ADC
Table
Frequency typical value from 32.768 to 31.25.
Current at T
conditions to 1.8 V, ILoad = 600A respectively.
to be 1.13 instead of 1.15.
suffixes.
Updated electrical characteristic data.
Typical Operation table.
31) in the “Enter Keyword” search box at the top of the page.
Table 31,
®
Table 32. Revision History
website (http://www.freescale.com), and enter the appropriate
A
= 125°C.
or
Description
Freescale Semiconductor

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