NCP2811BFCCT1G ON Semiconductor, NCP2811BFCCT1G Datasheet - Page 5

• Manufacturer Part Number: NCP2811BFCCT1G
• Description: IC HEADSET AUDIO AMP 12-FLIPCHIP
• Manufacturer: ON Semiconductor
• Series: NOCAP™r
• Type: Class ABr

Specifications of NCP2811BFCCT1G

• Output Type: 2-Channel (Stereo) with Stereo Headphones
• Max Output Power X Channels @ Load: 27mW x 1 @ 16 Ohm
• Voltage - Supply: 2.7 V ~ 5 V
• Features: Depop, Differential Inputs, Shutdown, Thermal Protection
• Mounting Type: Surface Mount
• Package / Case: *
• Polarity: Negative, Positive
• Input Voltage Max: 5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• No. Of Channels: 2
• Output Power: 27mW
• Supply Voltage Range: 2.7V To 5V
• Thd + N: 0.01% @ 25mW, 16ohm, VIN=3.6V
• Load Impedance: 16ohm
• Operating Temperature Range: -40°C To +85°C
• Amplifier Case Style: CSP
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: NCP2811BFCCT1GOSTR

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
Notes:
1. Maximum electrical ratings are defined as those values beyond which damage to the device may occur at T
2. According to JEDEC standard JESD22−A108B.
3. This device series contains ESD protection and passes the following tests:
4. Latch up Current Maximum Rating: ±100 mA per JEDEC standard: JESD78 class II.
5. Moisture Sensitivity Level (MSL): 1 per IPC/JEDEC standard: J−STD−020A.
6. The thermal shutdown set to 150°C (typical) avoids irreversible damage on the device due to power dissipation.
7. The R
Table 2. MAXIMUM RATINGS
Human Body Model (HBM) ESD Rating are (Note 3)
Machine Model (MM) ESD Rating are (Note 3)
CSP 1.5 x 2.0 mm package (Notes 6 and 7)
Maximum Junction Temperature (Note 6)
AVIN, PVIN Pins: Power Supply Voltage (Note 2)
INL, INR Pins: Input (Note 2)
SD Pin: Input (Note 2)
Operating Ambient Temperature Range
Operating Junction Temperature Range
Storage Temperature Range
Moisture Sensitivity (Note 5)
Human Body Model (HBM) ±2.0 kV per JEDEC standard: JESD22−A114 for all pins.
Machine Model (MM) ±200 V per JEDEC standard: JESD22−A115 for all pins.
50 mm
Thermal Resistance Junction to Case
A version
B version
JA
2
. The bumps have the same thermal resistance and all need to be connected to optimize the power dissipation.
is highly dependent of the PCB Heatsink area. For example, R
R
qCA
+
125 * T
P
D
A
Rating
* R
qJC
http://onsemi.com
5
JA
can equal 195°C/W with 50 mm
ESD HBM
ESD MM
Symbol
T
R
T
MSL
V
JMAX
V
V
T
T
STG
qJC
YY
IN
A
P
J
−V
−0.3 to V
P
− 0.3 to + 6.0
−40 to + 125
−65 to + 150
2
– 0.3 to V
−40 to + 85
total area and also 135°C/W with
−2 to +2
(Note 7)
Level 1
Value
+ 150
2000
200
A
= 25°C.
P
+ 0.3
P
+ 0.3
°C/W
Unit
°C
°C
°C
°C
V
V
V
V
V