SI2707-A10-GM Silicon Laboratories Inc, SI2707-A10-GM Datasheet - Page 5

AMPLIFIER AUDIO CLASS D 24QFN

SI2707-A10-GM

Manufacturer Part Number
SI2707-A10-GM
Description
AMPLIFIER AUDIO CLASS D 24QFN
Manufacturer
Silicon Laboratories Inc
Type
Class Dr
Datasheet

Specifications of SI2707-A10-GM

Output Type
2-Channel (Stereo) with Stereo Headphones
Package / Case
24-VFQFN Exposed Pad
Max Output Power X Channels @ Load
5W x 2 @ 3 Ohm
Voltage - Supply
4 V ~ 6.6 V
Features
Depop, I²S, Short-Circuit and Thermal Protection, Tone and Volume Control
Mounting Type
Surface Mount
Product
Class-D
Output Power
5 W
Thd Plus Noise
0.1 %
Supply Current
100 mA
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Audio Load Resistance
8 Ohms
Input Offset Voltage
Minimum Operating Temperature
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
336-1928

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Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
SI2707-A10-GM
Quantity:
457
1. Electrical Specifications
Table 1. Recommended Operating Conditions
Table 2. Absolute Maximum Ratings
Power Output Supply Voltage
Main Supply Voltage
Interface (I/O) Supply Voltage
Load Impedance
Ambient Temperature
Junction Temperature
Case Delta from Junction
Delta from Junction to Ambient
Notes:
Power Output Supply Voltage
Main Supply Voltage
Interface (I/O) Supply Voltage
Input Current
Input Voltage
Operating Temperature
Junction Temperature
Storage Temperature
Notes:
1. All minimum and maximum specifications are guaranteed and apply across the recommended operating conditions.
2. Operation with V
3. The
1. Permanent device damage may occur if the above Absolute Maximum Ratings are exceeded. Functional operation
2. For input pins SCLK, SDIO, DCLK, DFS, DIN, RST, OUTSEL, MFPx.
Typical values apply at V
otherwise stated.
assuming adequate ground plane as in “AN470: 270x Layout Guidelines.”
should be restricted to the conditions as specified in the operational sections of this data sheet. Exposure beyond
recommended operating conditions for extended periods may affect device reliability.
Parameter
JA
2
2
is layout-dependent; therefore, PCB layout must provide adequate heat-sink capability. The.
Parameter
PP
as low as 3 V is possible at reduced performance.
DD
3
= 3.3 V and 25 °C unless otherwise stated. Parameters are tested in production unless
Symbol
V
V
V
R
T
T
JC
JA
DD
PP
IO
L
A
J
1
Temperature delta between junc-
tion and top center of package
Rev. 0.6
1
Symbol
Test Condition
QFN package
V
V
V
V
I
T
T
T
IN
PP
DD
IO
IN
eTQFP
A
A
J
Si2704/05/06/07-A10
–0.3 to (V
–55 to +150
–0.5 to 3.9
–20 to +85
–0.5 to 7.0
–0.5 to 3.9
Value
1.62
4.0
Min
–20
150
2.7
10
IO
2
+ 0.3)
Typ
3–8
3.3
25
25
30
JA
Max
135
6.6
3.6
3.6
85
is specified,
5
Unit
mA
°C
°C
°C
V
V
V
V
°C/W
°C/W
°C/W
Unit
°C
°C
V
V
V
5

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