TSL1401CS-LF TAOS, TSL1401CS-LF Datasheet - Page 14

• Manufacturer Part Number: TSL1401CS-LF
• Description: Photodiodes Linear Sensor Array 400dpi 128pix
• Manufacturer: TAOS
• Type: Linear Sensor Arrayr

Specifications of TSL1401CS-LF

• Peak Wavelength: 1000 nm
• Maximum Rise Time: 500 ns
• Maximum Fall Time: 500 ns
• Package / Case: SMD-8
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• Mounting Style: SMD/SMT
• Product: Ambient Light Sensor
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

TSL1401CS−LF
128 × 1 LINEAR SENSOR ARRAY WITH HOLD
TAOS072E − APRIL 2007
Tooling Required
Process
14
Copyright E 2007, TAOS Inc.
This product, in the solder bump linear array package, has been tested and has demonstrated an ability to be
reflow soldered to a PCB substrate. The process, equipment, and materials used in these tests are detailed
below.
D
D
1. Apply solder paste using stencil
2. Dispense adhesive dots
3. Place component
4. Reflow solder/cure
5. X-Ray verify
Placement of the TSL1401CS−LF device onto the gold immersion substrate is accomplished using a standard
surface mount manufacturing process. First, using the stencil with 0.36 mm square aperture, print solder paste
onto the substrate. Next, dispense two 0.25 mm to 0.4 mm diameter dots of adhesive in opposing corners of
the TSL1401CS−LF mounting area. Machine place the TSL1401CS−LF from the JEDEC waffle carrier onto the
substrate. A suggested pick-up tool is the Siemens Vacuum Pickup tool nozzle number 912. This nozzle has
a rubber tip with a diameter of approximately 0.75 mm. The part is picked up from the center of the body. Reflow
the solder and cure the adhesive using the solder profile shown in Figure 14.
The reflow profiles specified here describe expected maximum heat exposure of components during the solder
reflow process of product on a PWB. Temperature is measured at the top of component. The components
should be limited to one pass through the solder reflow profile used.
Solder stencil (round aperture size 0.36 mm, stencil thickness of 152.4 μm)
20
×
20 frame for solder stencil
Average temperature gradient in preheating
Soak time
Time above T
Time above T
Time above T
Peak temperature in reflow
Temperature gradient in cooling
Table 1. TSL1401CS−LF Solder Reflow Profile
1
2
3
, 217°C
, 230°C
, (T
PARAMETER
MANUFACTURING INFORMATION
peak
−10°C)
r
www.taosinc.com
REFERENCE
T
t
soak
peak
t
t
t
1
2
3
r
260°C (−0°C/+5°C)
TSL1401CS−LF
2 to 3 minutes
Max −5°C/sec
Max 60 sec
Max 50 sec
Max 10 sec
2.5°C/sec
The LUMENOLOGY r Company