FOD817C3SD Fairchild Semiconductor, FOD817C3SD Datasheet - Page 11

• Manufacturer Part Number: FOD817C3SD
• Description: Transistor Output Optocouplers TRANSISTOR OUTPUT SMD LEAD BEND VDE
• Manufacturer: Fairchild Semiconductor

Specifications of FOD817C3SD

• Maximum Fall Time: 18 us
• Maximum Input Diode Current: 50 mA
• Maximum Reverse Diode Voltage: 6 V
• Maximum Rise Time: 18 us
• Output Device: Transistor
• Output Type: DC
• Configuration: 1
• Input Type: DC
• Maximum Collector Emitter Voltage: 70 V
• Maximum Collector Emitter Saturation Voltage: 200 mV
• Isolation Voltage: 5000 Vrms
• Current Transfer Ratio: 400 %
• Maximum Forward Diode Voltage: 1.4 V
• Maximum Collector Current: 50 mA
• Maximum Power Dissipation: 200 mW
• Maximum Operating Temperature: + 110 C
• Minimum Operating Temperature: - 55 C
• Package / Case: PDIP SMD Black
• Number Of Elements: 1
• Reverse Breakdown Voltage: 6V
• Forward Voltage: 1.4V
• Forward Current: 50mA
• Collector-emitter Voltage: 70V
• Package Type: PDIP-B SMD
• Collector Current (dc) (max): 50mA
• Power Dissipation: 200mW
• Collector-emitter Saturation Voltage: 0.2V
• Fall Time: 18000ns
• Rise Time: 18000ns
• Pin Count: 4
• Mounting: Surface Mount
• Operating Temp Range: -55C to 110C
• Operating Temperature Classification: Industrial
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: FOD817C3SD_NL

©2006 Fairchild Semiconductor Corporation
FOD814 Series, FOD817 Series Rev. 1.1.4
Lead Free Recommended IR Reflow Condition
Recommended Wave Soldering condition
Profile Feature
Preheat condition
(Tsmin-Tsmax / ts)
Melt soldering zone
Peak temperature (Tp)
Ramp-down rate
Profile Feature
Peak temperature (Tp)
Tsmax
Tsmin
25 C
Tp
ts (Preheat)
Pb-Sn solder assembly
100°C ~ 150°C
6°C/sec max.
60 ~ 120 sec
60 ~ 120 sec
240 +0/-5°C
183°C
Time (sec)
11
For all solder assembly
Max 260°C for 10 sec
Soldering zon
Ramp-down
Lead Free assembly
150°C ~ 200°C
6°C/sec max.
60 ~120 sec
260 +0/-5°C
30 ~ 90 sec
217°C
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