STEVAL-TDR029V1 STMicroelectronics, STEVAL-TDR029V1 Datasheet
STEVAL-TDR029V1
Specifications of STEVAL-TDR029V1
Related parts for STEVAL-TDR029V1
STEVAL-TDR029V1 Summary of contents
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... Efficiency typ ■ Harmonics dBc max ■ Gain flatness: ± 0.5 dB max Description The STEVAL-TDR029V1 broadband power amplifier intended for FM broadcast radio transmitters over the band 87.5 to 108 MHz using 2x STAC2942B N-channel MOS field-effect transistors. STEVAL-TDR029V1 is designed in cooperation with InnovAction S.r.l in italy. ...
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... Surface conditions of the mounting base . . . . . . . . . . . . . . . . . . . . . . . . . . 6 4.4 Thermal interface material . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 4.5 Seating plane . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 4.6 Printed circuit board (PCB) considerations . . . . . . . . . . . . . . . . . . . . . . . . 7 4.7 Package attachment to thermal base . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 4.7.1 4.7.2 4.8 Electrical connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 4.9 Conclusion . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 5 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 2/10 Hardware Procedure Doc ID 17470 Rev 1 STEVAL-TDR029V1 ...
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... STEVAL-TDR029V1 1 Electrical data 1.1 Maximum ratings Table 2. Absolute maximum ratings Symbol OUT T STG DISS 2 Electrical characteristics + Table 3. Electrical specification Symbol Frequency Frequency range P OUT Gain P OUT ND P OUT harmonic @ harmonic @ P FL Gain flatness @ P Parameter Input power Output power Storage temperature range ...
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... Circuit layout and connections 3 Circuit layout and connections Figure 1. Circuit layout and connections 4/10 Doc ID 17470 Rev 1 STEVAL-TDR029V1 ...
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... STEVAL-TDR029V1 4 STAC2942B mounting recommendations 4.1 Introduction RF power transistors are amongst the highest power density devices in the semiconductor industry crucial to the reliability and performance of such devices to give additional consideration to mechanical stresses and thermal and electrical resistances within the application environment. The general purpose of this section is to provide guidelines for mechanically mounting STAC™ ...
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... PCB, to avoid shear stresses which could cause damage to the interface between the lead and the package body. ● Care should be taken to factor in the thickness of the TIM used, which is equivalent to increasing the seating plane dimension. 6/10 Doc ID 17470 Rev 1 STEVAL-TDR029V1 ...
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... STEVAL-TDR029V1 If the PCB is fused to the heatsink by means of a bonding film, solder layer, etc., the corresponding thickness of this layer should be factored into the PCB thickness. 4.6 Printed circuit board (PCB) considerations It is advisable to specify a “package-cut”, or slot, through the board and mount the transistor directly to the heatsink for optimum performance ...
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... In terms of thermal resistance, these recommendations should provide an exceptionally low thermal resistance between the transistor case and the mounting base (R order of 0.05 °C/W for most products. 8/10 Doc ID 17470 Rev 1 STEVAL-TDR029V1 ), on the thc-mb ...
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... STEVAL-TDR029V1 5 Revision history Table 4. Document revision history Date 03-Jun-2010 Revision 1 Initial release. Doc ID 17470 Rev 1 Revision history Changes 9/10 ...
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... Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America 10/10 Please Read Carefully: © 2010 STMicroelectronics - All rights reserved STMicroelectronics group of companies www.st.com Doc ID 17470 Rev 1 STEVAL-TDR029V1 ...