AG403-89PCB TriQuint, AG403-89PCB Datasheet - Page 5

• Manufacturer Part Number: AG403-89PCB
• Description: RF Modules & Development Tools 700-2400MHz Eval Brd 18dBm 21dB Gain
• Manufacturer: TriQuint

Specifications of AG403-89PCB

• Board Size: 4.25 mm x 4.6 mm x 1.6 mm
• Minimum Frequency: 700 MHz
• Minimum Operating Temperature: - 40 C
• Supply Voltage (min): 4.91 V
• Product: RF Modules
• Maximum Frequency: 6 GHz
• Supply Voltage (max): 6.2 V
• Supply Current: 60 mA
• Maximum Operating Temperature: + 85 C
• For Use With/related Products: AG403
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 1067186

WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: [phone] • e-mail: [e-mail] • Web site: www.wj.com, www.TriQuint.com
This package is lead-free/Green/RoHS-compliant. It is compatible with both lead-free (maximum 260 °C reflow temperature) and leaded
AG403-89G (Green / Lead-free SOT-89 Package) Mechanical Information
AG403-89
InGaP HBT Gain Block
XXXX-X
A403G
(maximum 245 °C reflow temperature) soldering processes. The plating material on the leads is NiPdAu.
Outline Drawing
Land Pattern
Specifications and information are subject to change without notice
The AG403-89G will be marked with an
“A403G” designator with an alphanumeric lot
code marked below the part designator.
obsolete tin-lead package is marked with an
“AG403”
alphanumeric lot code.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
ESD Rating: Class 1C
Value:
Test:
Standard:
ESD Rating: Class IV
Value:
Test:
Standard:
MSL Rating: Level 3 at +260 °C convection reflow
Standard:
1. Ground / thermal vias are critical for the proper
2. Add as much copper as possible to inner and outer layers
3. Mounting screws can be added near the part to fasten the
4. Do not put solder mask on the backside of the PC board in
5. RF trace width depends upon the PC board material and
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles are in
Mounting Config. Notes
performance of this device. Vias should use a .35mm
(#80 / .0135”) diameter drill and have a final plated thru
diameter of .25 mm (.010”).
near the part to ensure optimal thermal performance.
board to a heatsink. Ensure that the ground / thermal via
region contacts the heatsink.
the region where the board contacts the heatsink.
construction.
degrees.
Product Marking
MSL / ESD Rating
Passes ≥ 1000V min.
Human Body Model (HBM)
JEDEC Standard JESD22-A114
Passes ≥ 1000V min.
Charged Device Model (CDM)
JEDEC Standard JESD22-C101
JEDEC Standard J-STD-020
designator
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January 2008
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an