AH11PP1900-PCB TriQuint, AH11PP1900-PCB Datasheet - Page 5

• Manufacturer Part Number: AH11PP1900-PCB
• Description: RF Modules & Development Tools 1900MHz Push-Pull Eval Brd 12dB Gain
• Manufacturer: TriQuint

Specifications of AH11PP1900-PCB

• Board Size: 6.2 mm x 5 mm x 1.62 mm
• Minimum Frequency: 150 MHz
• Minimum Operating Temperature: - 40 C
• Supply Voltage (min): 5 V
• Product: RF Modules
• Maximum Frequency: 3 GHz
• Supply Voltage (max): 6 V
• Supply Current: 150 mA
• Maximum Operating Temperature: + 85 C
• For Use With/related Products: AH11
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 1067272

TriQuint Semiconductor, Inc • Phone 1-800-WJ1-4401 • FAX: [phone] • e-mail: [e-mail] • Web site: www. TriQuint.com
This package is lead-free/Green/RoHS-compliant. The plating material on the leads is NiPdAu. It is compatible with both
lead-free (maximum 260 °C reflow temperature) and lead (maximum 245 °C reflow temperature) soldering processes.
AH11
High Dynamic Range Dual Amplifier
Outline Drawing
Land Pattern
AH11-G Mechanical Information
Specifications and information are subject to change without notice
The component will be marked with an
“AH11-G” designator with an alphanumeric
lot code on the top surface of the package.
The obsolete tin-lead package is marked with
an “AH11” designator followed by an
alphanumeric lot code.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
The backside paddle is the Source and should be
grounded for thermal and electrical purposes.
ESD Rating: Class 1B
Value:
Test:
Standard:
ESD Rating: Class IV
Value
Test:
Standard:
MSL Rating: Level 2 at +260 °C convection reflow
Standard:
1.
2.
3.
4.
5.
6.
7.
8.
9.
Mounting Config. Notes
ESD / MSL Information
Functional Pin Layout
Ground / thermal vias are critical for the proper performance
of this device.
diameter drill and have a final plated through diameter
of .25mm (.010”)
Add as much copper as possible to inner and outer layers
near the part to ensure optimal thermal performance.
To ensure reliable operation, device ground paddle-to-
ground pad solder joint is critical.
Add mounting screws near the part to fasten the board to a
heatsink.
contacts the heatsink.
For optimal thermal performance, expose soldermask on
backside where it contacts the heatsink.
RF trace width depends upon the PC board material and
construction.
Use 1 oz. Copper minimum.
If the PCB design rules allow, ground vias should be placed
under the land pattern for better RF and thermal performance.
Otherwise ground vias should be placed as close to the land
pattern as possible.
All dimensions are in mm. Angles are in degrees.
Product Marking
Pin
1
2
3
4
5
6
7
8
Ensure that the ground / thermal via region
Passes from 500 to 1000 V
Human Body Model (HBM)
JEDEC Standard JESD22-A114
Passes greater than 1000 V
Charge Device Model (CDM)
JEDEC Standard JESD22-C101
JEDEC Standard J-STD-020A
Function
RF input (Amp1 input)
Ground
Ground
RF input (Amp2 input)
RF output (Amp2 output)
Ground
Ground
RF output (Amp1 output)
Vias should use a .35mm (#80/.0135”)
Page 5 of 6 December 2008