450-0016 LS Research, 450-0016 Datasheet - Page 23

• Manufacturer Part Number: 450-0016
• Description: Zigbee / 802.15.4 Modules & Development Tools Si-FLEX 900 MHz DSSS w/U.FL Conn.
• Manufacturer: LS Research

Specifications of 450-0016

• Wireless Frequency: 900 MHz
• Modulation: DSSS, OQPSK
• Security: 128 bit AES
• Operating Voltage: 3.3 V
• Output Power: 250 mW
• Antenna: U.FL Connector
• Operating Temperature Range: - 40 C to + 85 C
• For Use With/related Products: ATXMEGA256A3
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

CLEANING
In general, cleaning the populated modules is
strongly discouraged. Residuals under the
module cannot be easily removed with any
cleaning process.
OPTICAL INSPECTION
After soldering the Module to the host board,
consider optical inspection to check the
following:
REWORK
The SiFLEX02 module can be unsoldered from
the host board. Use of a hot air rework tool and
hot plate for pre-heating from underneath is
recommended. Avoid overheating.
The information in this document is subject to change without notice.
Confirm the data is current by downloading the latest revision from www.lsr.com.
330-0009-R2.2






Never attempt a rework on the
module
individual components. Such actions
will terminate warranty coverage.
Cleaning with water can lead to capillary
effects where water is absorbed into the gap
between the host board and the module.
The combination of soldering flux residuals
and encapsulated water could lead to short
circuits between neighboring pads. Water
could also damage any stickers or labels.
Cleaning with alcohol or a similar organic
solvent will likely flood soldering flux
residuals into the RF shield, which is not
accessible for post-washing inspection. The
solvent could also damage any stickers or
labels.
Ultrasonic cleaning could damage the
module permanently.
Proper alignment and centering of the
module over the pads.
Proper solder joints on all pads.
Excessive solder or contacts to neighboring
pads, or vias.
itself,
e.g.
Copyright © 2009-2011 LS Research, LLC
replacing
SHIPPING, HANDLING, AND STORAGE
Shipping
Bulk orders of the SiFLEX02 modules are
delivered in trays of 50.
Handling
The SiFLEX02 modules contain a highly
sensitive electronic circuitry. Handling without
proper ESD protection may destroy or damage
the module permanently. ESD protection may
destroy or damage the module permanently.
Moisture Sensitivity Level (MSL)
MSL 4, per J-STD-020
Devices not stored in a sealed bag with
desiccant pack should be baked.
After opening devices that will be subjected to
reflow must be mounted within 72 hours of
factory conditions (<30°C and 60% RH) or
stored at <10% RH.
Bake devices for 8 hours at 125°C.
Storage
Storage/shelf life in sealed bags is 12 months at
<40°C and <90% relative humidity.
Repeating Reflow Soldering
Only
process
boards.
SiFLEX02 TRANSCEIVER MODULE
a
is encouraged
single
reflow
DATASHEET
soldering
for
Page 23 of 33
host