HM226-L Hendon Semiconductors, HM226-L Datasheet - Page 13

• Manufacturer Part Number: HM226-L
• Description: Switch Modules & Development Tools IES5541A demoboard Logic Input Control
• Manufacturer: Hendon Semiconductors

Specifications of HM226-L

• Description/function: Relay Switch Demo Board
• Board Size: 70 mm x 61 mm
• Maximum Operating Temperature: + 70 C
• Minimum Operating Temperature: 0 C
• Supply Current: 10 A
• For Use With/related Products: IES5541A
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

10 IMPORTANT ELECTRICAL SAFETY WARNING
The HM226 circuit is connected to the mains electrical supply and operates at voltages which need to be protected by
proper enclosure and protective covering. While it has been designed to conform to relevant Australian and overseas
Standards (such as IEC60335), it should only be used in a manner that ensures the appliance in which they are used
complies with all relevant safety and other requirements.
The board must be mounted with non-conductive clips, and positioned such that the minimum creepage distances from
the circuit assembly to earth, and between high voltage points is not transgressed.
The NTC element is electrically live and connected to the mains, and must therefore be electrically insulated. Also
creepage distances must be maintained for all live parts in the circuit and its wiring, especially with respect to the NTC
thermistor.
It should be noted that there are Mains Voltages on the circuit board. Adequate labelling should be attached to warn
service personnel, and others, that this danger exists.
The board should be mounted in a place that is clean and dry at all times, not subject to condensation or the accumulation
of dust and other contaminants.
11 REFERENCES
• Data Sheet - IES5541A Relay Driver and Contact ProtectionIC
• Application Note - AN005 Relay Drive Circuit
12 DOCUMENT HISTORY
2007 Dec 11, Revision 5.0
REVISION
0.1
0.2
0.3
0.4
0.5
07 June 2006
28 June 2006
19 November
09 May 2006
14 August
DATE
2007
2007
First Issue
1. Minor corrections made to document body.
2. Company address updated (section 15).
3. Revision level added to document.
4. Document history added (section 13).
1. Incuded CRO trace and explaination section 6
2. Changed format to new IES datasheet format
1. Removed CRO trace and explaination section 6 pending update
2. Changed format to new Hendon datasheet format
3. Update to new layout and schematics
1. Changed mains voltages for consistency
2. Swapped Logic/Thermostat order
13
Protected Relay Switching Module
DESCRIPTION
Engineering Sample Information
HM226 - L / T