AH103A-G TriQuint, AH103A-G Datasheet - Page 6

• Manufacturer Part Number: AH103A-G
• Description: RF Amplifier 60-2700MHz 29dB Gain@900MHz
• Manufacturer: TriQuint
• Type: Gain Amplifierr

Specifications of AH103A-G

• Mounting Style: SMD/SMT
• Number Of Channels: 2
• Operating Frequency: 2700 MHz
• Noise Figure: 3 dB @ 1900 MHz
• Operating Supply Voltage: 4.5 V
• Supply Current: 330 mA @ 9 V
• Maximum Operating Temperature: + 160 C
• Minimum Operating Temperature: - 40 C
• Package / Case: SOIC-8
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 1066930

WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: [phone] • e-mail: [e-mail] • Web site: www.wj.com, www.TriQuint.com
This package is lead-free/green/RoHS-compliant. The plating material on the leads is NiPdAu. It is compatible with both lead-free
Mounting Configuration / Land Pattern
AH103A
High Gain, High Linearity ½-Watt Amplifier
(maximum 260°C reflow temperature) and lead (maximum 245°C reflow temperature) soldering processes.
AH103A-G (Lead-Free Package) Mechanical Information
Outline Drawing
Specifications and information are subject to change without notice
The component will be marked with an
“103AG” designator followed by a alpha-
numeric lot code on the top surface of the
package.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
ESD Rating:
Value:
Test:
Standard:
ESD Rating:
Value:
Test:
Standard:
MSL Rating:
Standard:
The backside paddle is the Source and should be
grounded for thermal and electrical purposes. All
other pins should be grounded on the PCB.
1.
2.
3.
4.
5.
6.
7.
8.
9.
Mounting Config. Notes
ESD / MSL Information
Functional Pin Layout
Ground / thermal vias are critical for the proper performance
of this device. Vias should use a .35mm (#80 / .0135”)
diameter drill and have a final plated thru diameter of .25
mm (.010”).
Add as much copper as possible to inner and outer layers
near the part to ensure optimal thermal performance.
To ensure reliable operation, device ground paddle-to-
ground pad solder joint is critical.
Add mounting screws near the part to fasten the board to a
heatsink.
contacts the heatsink.
For optimal thermal performance, expose soldermask on
backside where it contacts the heatsink.
RF trace width depends upon the PC board material and
construction.
Use 1 oz. Copper minimum.
All dimensions are in millimeters. Angles are in degrees.
A heatsink underneath the area of the PCB for the mounted
device is strictly required for proper thermal operation.
Damage to the device can occur without the use of one.
Pin
1
2
3, 5, 8
4
6
7
Product Marking
Ensure that the ground / thermal via region
Function
Amp2 input
Amp1 output / Bias Amp1
Ground
RF input (Amp1 input)
RF output (Amp2 output)
Bias Amp2
Class 1B
Passes
Human Body Model (HBM)
JEDEC Standard JESD22-A114
Class III
Passes
Charged Device Model (CDM)
JEDEC Standard JESD22-C101
Level 2 at +260 °C convection reflow
JEDEC Standard J-STD-020
500 V to <1000 V
500 V to <1000 V
Page 6 of 6 December 2007