TSL2569T TAOS, TSL2569T Datasheet - Page 33

• Manufacturer Part Number: TSL2569T
• Description: Light to Digital Converters Light to Digital Sensor
• Manufacturer: TAOS

Specifications of TSL2569T

• Data Bus Width: 20 bit
• Peak Wavelength: 640 nm, 940 nm
• Maximum Operating Frequency: 780 KHz
• Operating Supply Voltage: 2.7 V to 3.6 V
• Operating Current: 0.6 mA to 15 uA
• Maximum Operating Temperature: + 70 C
• Minimum Operating Temperature: - 30 C
• Interface Type: I2C
• Maximum Fall Time: 300 ns
• Maximum Rise Time: 300 ns
• Mounting Style: SMD/SMT
• Resolution: 16 bit
• Package / Case: TMB-6
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Tooling Required
Process
Additional Notes for Chipscale
The LUMENOLOGY r Company
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1. Apply solder paste using stencil
2. Place component
3. Reflow solder/cure
4. X-Ray verify (recommended for chipscale only)
Placement of the TSL2568/TSL2569 chipscale device onto the gold immersion substrate is accomplished using
a standard surface mount manufacturing process. Using a 152-μm stencil with a 0.21 mm square aperture, print
solder paste onto the substrate. Machine-place the TSL2568/TSL2569 from the tape onto the substrate. A
suggest pick-up tool is the Siemens Vacuum Pickup tool nozzle number 912. This nozzle has a rubber tip with
a diameter of approximately 0.75 mm. The part is picked up from the center of the body.
It is important to use a substrate that has an immersion plating surface. This may be immersion gold, solder,
or white tin. Hot air solder leveled (HASL) substrates are not coplanar, making them difficult to work with.
− Solder stencil (square aperture size 0.210 mm, stencil thickness of 152 μm)
− Solder stencil (aperture size 0.70 mm x 0.90 mm, stencil thickness of 152 μm)
Chipscale
TMB
MANUFACTURING INFORMATION
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www.taosinc.com
LIGHT-TO-DIGITAL CONVERTER
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TSL2568, TSL2569
TAOS091D − DECEMBER 2008
Copyright E 2008, TAOS Inc.
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