TSL2560FN TAOS, TSL2560FN Datasheet - Page 40
![Light to Digital Converters Ambient Light Sensor SMBus](/photos/16/3/160351/tsl2561fn_sml.jpg)
TSL2560FN
Manufacturer Part Number
TSL2560FN
Description
Light to Digital Converters Ambient Light Sensor SMBus
Manufacturer
TAOS
Datasheet
1.TSL2561T.pdf
(42 pages)
Specifications of TSL2560FN
Data Bus Width
20 bit
Peak Wavelength
640 nm, 940 nm
Maximum Operating Frequency
780 KHz
Operating Supply Voltage
2.7 V to 3.6 V
Operating Current
0.6 mA to 15 uA
Maximum Operating Temperature
+ 70 C
Minimum Operating Temperature
- 30 C
Interface Type
I2C
Maximum Fall Time
300 ns
Maximum Rise Time
300 ns
Mounting Style
SMD/SMT
Resolution
16 bit
Package / Case
DFN-6
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
TSL2560, TSL2561
LIGHT-TO-DIGITAL CONVERTER
TAOS059N − MARCH 2009
40
Copyright E 2009, TAOS Inc.
The CS, T, FN, and CL packages have been tested and have demonstrated an ability to be reflow soldered to
a PCB substrate. The process, equipment, and materials used in these test are detailed below.
The solder reflow profile describes the expected maximum heat exposure of components during the solder
reflow process of product on a PCB. Temperature is measured on top of component. The components should
be limited to a maximum of three passes through this solder reflow profile.
T
peak
T
T
T
3
2
1
Time (sec)
Average temperature gradient in preheating
Soak time
Time above 217°C
Time above 230°C
Time above T
Peak temperature in reflow
Temperature gradient in cooling
Figure 31. TSL2560/TSL2561 Solder Reflow Profile Graph
peak
PARAMETER
Table 13. TSL2560/61 Solder Reflow Profile
−10°C
MANUFACTURING INFORMATION
t
soak
r
www.taosinc.com
REFERENCE
T
t
soak
peak
t
t
t
1
2
3
260° C (−0°C/+5°C)
r
2 to 3 minutes
Max −5°C/sec
TSL2560/61
Max 60 sec
Max 50 sec
Max 10 sec
2.5°C/sec
t
t
t
3
2
1
Not to scale — for reference only
The LUMENOLOGY r Company