300P14-U THAT Corporation, 300P14-U Datasheet - Page 4
![no-image](/images/no-image-200.jpg)
300P14-U
Manufacturer Part Number
300P14-U
Description
Bipolar Small Signal 4 NPN Matched Trans. Array DIP-14
Manufacturer
THAT Corporation
Datasheet
1.320S14-U.pdf
(5 pages)
Specifications of 300P14-U
Dc Collector/base Gain Hfe Min
60
Gain Bandwidth Product Ft
350 MHz
Minimum Operating Temperature
0 C
Configuration
Quad
Transistor Polarity
NPN
Mounting Style
Through Hole
Package / Case
DIP-14
Collector- Emitter Voltage Vceo Max
40 V
Emitter- Base Voltage Vebo
5 V
Continuous Collector Current
10 A
Maximum Dc Collector Current
20 A
Maximum Operating Temperature
+ 70 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Document 600041 Rev 02
PDIP and 14-pin surface mount (SOIC) packages.
Package dimensions are shown below.
lead-frames are copper, plated with successive layers of
nickel, palladium, and gold. This approach makes it
possible to solder these devices using lead-free and lead-
bearing solders.
Parameter
Through-hole package
Surface mount package
(1.52)
0.060
Thermal Resistance
Environmental Regulation Compliance
Thermal Resistance
Soldering Reflow Profile
Moisture Sensitivity Level
Environmental Regulation Compliance
Typ.
The THAT 300, 320 and 340 are available in 14-pin
The 300-series packages are entirely lead-free. The
1
Figure 4. Dual-In-Line Package Outline
(19.05±0.10)
0.750±0.004
(1.91)
0.075
0.10 Typ.
(2.54)
THAT Corporation; 45 Sumner Street; Milford, Massachusetts 01757-1656; USA
Tel: +1 508 478 9200; Fax: +1 508 478 0990; Web: www.thatcorp.com
0.125±0.004
(3.18±0.10)
(0.46)
0.018
Packaging and Soldering Information
Symbol
(6.35±0.10)
0.25±.004
MSL Above-referenced JEDEC soldering profile
θ
θ
Copyright © 2010, THAT Corporation. All rights reserved.
JA
JA
DIP package soldered to board
(7.62 ±0.5)
SO package soldered to board
0.30 ±0.02
(0.25)
0.010
Complies with January 27, 2003 RoHS requirements
Package Characteristics
See Fig. 4 for dimensions
See Fig. 5 for dimensions
Conditions
Page 4 of 5
compounds used in the 300-series contains any hazard-
ous substances as specified in the European Union's
Directive on the Restriction of the Use of Certain Hazard-
ous Substances in Electrical and Electronic Equipment
2002/95/EG of January 27, 2003. The surface-mount
package is suitable for use in a 100% tin solder process.
Neither the lead-frames nor the plastic mold
1
Figure 5. Surface-Mount Package Outline
0.344 (8.74)
(1.27)
0.050
0.018 (0.46)
Max
Typ
Max
JEDEC JESD22-A113-D (250 ºC)
THAT 300 Series Transistor Array ICs
Complies with RoHS requirements
14 Pin PDIP
14 Pin SOP
Typ
100
100
1
(3.99)
0.157
Max
(1.75)
0.069
Max
0.245
(6.2)
Max
(0.25)
0.010
Max
Units
ºC/W
ºC/W