S29GL032N90TFI010 Spansion Inc., S29GL032N90TFI010 Datasheet - Page 78
![Flash 3V 32Mb Float Gate highest address 90s](/photos/16/11/161172/s29gl512p11tfi020_sml.jpg)
S29GL032N90TFI010
Manufacturer Part Number
S29GL032N90TFI010
Description
Flash 3V 32Mb Float Gate highest address 90s
Manufacturer
Spansion Inc.
Datasheet
1.S29GL032N90TFI010.pdf
(81 pages)
Specifications of S29GL032N90TFI010
Memory Type
NOR
Memory Size
32 Mbit
Access Time
90 ns
Data Bus Width
8 bit, 16 bit
Architecture
Uniform / Boot Sector
Interface Type
Page-mode
Supply Voltage (max)
3.6 V
Supply Voltage (min)
2.7 V
Maximum Operating Current
50 mA
Mounting Style
SMD/SMT
Operating Temperature
+ 85 C
Package / Case
TSOP-56
Ic Interface Type
CFI, Parallel
Supply Voltage Range
2.7V To 3.6V
Memory Case Style
TSOP
No. Of Pins
56
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
S29GL032N90TFI010
Manufacturer:
Spansion
Quantity:
135
Company:
Part Number:
S29GL032N90TFI010H
Manufacturer:
SPANSION
Quantity:
6 793
17.5
78
LAE064-64-Ball Fortified Ball Grid Array (BGA) 9 x 9 mm Package
PACKAGE
JEDEC
SYMBOL
SD / SE
MD
ME
A1
A2
D1
E1
eD
eE
φb
A
D
E
N
0.40
0.60
0.50
MIN
---
9.00 mm x 9.00 mm
PACKAGE
9.00 BSC.
9.00 BSC.
7.00 BSC.
7.00 BSC.
1.00 BSC.
1.00 BSC.
0.50 BSC.
LAE 064
NONE
NOM
0.60
N/A
64
---
---
---
8
8
MAX
1.40
0.70
S29GL-N MirrorBit
---
---
PROFILE HEIGHT
STANDOFF
BODY THICKNESS
BODY SIZE
BODY SIZE
MATRIX FOOTPRINT
MATRIX FOOTPRINT
MATRIX SIZE D DIRECTION
MATRIX SIZE E DIRECTION
BALL COUNT
BALL DIAMETER
BALL PITCH - D DIRECTION
BALL PITCH - E DIRECTION
SOLDER BALL PLACEMENT
DEPOPULATED SOLDER BALLS
NOTE
D a t a
®
Flash Family
S h e e t
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994.
2. ALL DIMENSIONS ARE IN MILLIMETERS.
3. BALL POSITION DESIGNATION PER JESD 95-1, SPP-010
4.
5. SYMBOL "MD" IS THE BALL ROW MATRIX SIZE IN THE
6
7
8. NOT USED.
9. "+" INDICATES THE THEORETICAL CENTER OF
EXCEPT AS NOTED).
"D" DIRECTION.
SYMBOL "ME" IS THE BALL COLUMN MATRIX SIZE IN THE
"E" DIRECTION.
N IS THE TOTAL NUMBER OF SOLDER BALLS.
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
SD AND SE ARE MEASURED WITH RESPECT TO DATUMS
A AND B AND DEFINE THE POSITION OF THE CENTER
SOLDER BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN
THE OUTER ROW PARALLEL TO THE D OR E DIMENSION,
RESPECTIVELY, SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN
THE OUTER ROW, SD OR SE = e/2
DEPOPULATED BALLS.
e REPRESENTS THE SOLDER BALL GRID PITCH.
S29GL-N_01_12 October 29, 2008
3623 \ 16-038.12 \ 1.16.07