IES5541AT Hendon Semiconductors, IES5541AT Datasheet
IES5541AT
Specifications of IES5541AT
Related parts for IES5541AT
IES5541AT Summary of contents
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... Rb SENS C2 47uF 10V © 2006 Integrated Electronic Solutions Pty Ltd. trading as Hendon Semiconductors, all rights reserved. 2007 Aug 16, Revision 1.1 Relay Driver with Contact Protection 2 GENERAL DESCRIPTION The IES5541A is a monolithic bipolar control circuit for driving a relay protect its contacts from arcing during switching operations ...
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PINNING INFORMATION 5.1 Pinning layout (8 pin IES5541A 3 COM 4 SENS Fig.2 Pinning diagram (DIL-8 and SO-8) 6 FUNCTIONAL DESCRIPTION COM − Common DC supply 6.1 This DC supply rail for the control ...
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SCR gate pulse. This could much as 20ms delay (assuming 50Hz mains frequency) between CAP going high and the first SCR gate pulse. When the CAP pin is set “low”, the SCR gate drive will not ...
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LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134) Voltages are specified with respect to pin 3 (COM) SYMBOL PARAMETER V Supply voltage range ( Voltage range (PWR) PWR V Voltage range (CAP) CAP ...
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SYMBOL PARAMETER Sense input −V sense voltage SENS −V sense voltage SENS −∆ temperature sensitivity SENS V AC sense voltage SENS(rms sense voltage SENS(rms sense voltage SENS(rms sense voltage SENS(rms) V ...
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I NDUCTIVE LOADS It should be noted that for inductive loads the current will be lagging the voltage. Therefore every time the triac turns off it will produce a transient and hence be retriggered by the transient detection circuit ...
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R2 270k VR25 PWR 8 IES5541A SENS 4 VREG 3 6 CAP COM Vcc Micro- controller or 5V logic device Vee Fig.5 IES5541A application diagram: alternate options, for connecting a micro controller or other logic level input V DD Supply ...
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Additional components for critical applications, eg failsafe operation, Temperature Sense and Setting R1 VR1 NTC θ R2 Fig.8 IES5541A application diagram: alternative relay drive for 48V relays 2007 Aug 16, Revision 1.1 Relay Driver with Contact Protection Fig.7 IES5541A application ...
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... IES5541A P DIP8 plastic dual in-line package; 8 leads (300 mil) Other package options are available - contact Hendon Semiconductors for details. For more information on packages, please refer to the document “Integrated Circuit Packaging and Soldering Information” on the Hendon Semiconductors web site. ...
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... Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given advisory and does not form part of the specification. 14 COMPANY INFORMATION HENDON SEMICONDUCTORS a trading name of INTEGRATED ELECTRONIC SOLUTIONS PTY. LTD. ABN 17 080 879 616 Postal address: Hendon Semiconductors ...
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... Life Support Applications Products of Hendon Semiconductors (Hendon) are not designed for use in life support appliances, devices or systems, where malfunction can result in personal injury. Customers using or selling Hendon products for use in such applications their own risk and agree to fully indemnify Hendon for any damages resulting from such improper use or sale. ...