AGL1000V2-FGG144 Actel, AGL1000V2-FGG144 Datasheet - Page 20

• Manufacturer Part Number: AGL1000V2-FGG144
• Description: FPGA - Field Programmable Gate Array 1M System Gates IGLOO
• Manufacturer: Actel

Specifications of AGL1000V2-FGG144

• Processor Series: AGL1000
• Core: IP Core
• Maximum Operating Frequency: 526.32 MHz, 892.86 MHz
• Number Of Programmable I/os: 97
• Data Ram Size: 147456
• Supply Voltage (max): 1.575 V
• Maximum Operating Temperature: + 70 C
• Minimum Operating Temperature: 0 C
• Development Tools By Supplier: AGL-Icicle-Kit, AGL-Dev-Kit-SCS, Silicon-Explorer II, Silicon-Sculptor 3, SI-EX-TCA, FlashPro 4, FlashPro 3, FlashPro Lite
• Mounting Style: SMD/SMT
• Supply Voltage (min): 1.14 V
• Number Of Gates: 1 M
• Package / Case: FPBGA-144
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

IGLOO DC and Switching Characteristics
Table 2-5 •
2- 6
Package Type
Quad Flat No Lead
Very Thin Quad Flat Pack (VQFP)*
Chip Scale Package (CSP)*
Chip Scale Package (CSP)
Micro Chip Scale Package (UC)
Fine Pitch Ball Grid Array (FBGA)
Note:
Maximum Power Allowed
*Thermal Resistances for other device-package combinations will be posted on the next revision.
Package Thermal Characteristics
The device junction-to-case thermal resistivity is θ
θ
temperature is 110°C.
allowed for the AGL1000-FG484 package at commercial temperature and in still air.
Disclaimer:
The simulation for determining the junction-to-air thermal resistance is based on JEDEC standards
(JESD51) and assumptions made in building the model. Junction-to-case is based on SEMI G38-88.
JESD51 is only used for comparing one package to another package, provided the two tests uses the
same condition. They have little relevance in actual application and therefore should be used with a
degree of caution.
Package Thermal Resistivities
ja
. The thermal characteristics for θ
=
Max. junction temp. (°C) Max. ambient temp. (°C)
-------------------------------------------------------------------------------------------------------------------------------------- -
EQ 2
AGLE3000
AGLN020
AGLN250
AGLN020
AGL1000
AGL1000
AGL1000
AGL030
AGL060
AGL125
AGL250
AGL030
AGL030
AGL060
AGL250
AGL030
AGL060
AGL400
AGL250
Device
shows a sample calculation of the absolute maximum power dissipation
ja
are shown for two air flow rates. The absolute maximum junction
Pin Count
θ
ja
132
132
132
132
100
196
144
144
144
256
256
324
484
68
81
81
81
81
81
81
81
(°C/W)
R ev isio n 1 8
–
jc
and the junction-to-ambient air thermal resistivity is
TBD
TBD
TBD
TBD
13.4
10.0
TBD
12.5
12.4
10.4
10.4
18.2
16.9
18.6
12.0
11.1
6.3
6.8
6.6
2.9
8.0
θj
c
Still Air
21.4
21.2
21.1
21.0
68.4
35.3
57.8
34.0
32.8
28.8
28.0
26.9
44.3
40.6
55.2
31.6
37.6
38.6
28.1
24.0
23.3
=
110°C 70°C
------------------------------------
1 m/s
23.3°C/W
TBD
TBD
16.8
16.6
16.5
16.4
29.4
47.6
29.9
28.5
24.8
23.4
22.3
39.0
35.2
49.4
26.2
31.2
34.7
24.4
19.0
θ
ja
–
2.5 m/s
15.3
15.0
14.9
14.8
TBD
27.1
43.3
28.5
27.2
23.5
22.0
20.9
37.5
33.7
47.2
24.2
29.0
33.0
22.7
TBD
16.7
=
1.71 W
Unit
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
EQ 2