LFXP3C-3TN100I Lattice, LFXP3C-3TN100I Datasheet - Page 385

• Manufacturer Part Number: LFXP3C-3TN100I
• Description: FPGA - Field Programmable Gate Array 3.1K LUTs 62 IO 1.8/ 2.5/3.3V -3 Spd I
• Manufacturer: Lattice

Specifications of LFXP3C-3TN100I

• Number Of Programmable I/os: 62
• Data Ram Size: 55296
• Supply Voltage (max): 3.465 V
• Maximum Operating Temperature: + 100 C
• Minimum Operating Temperature: - 40 C
• Mounting Style: SMD/SMT
• Supply Voltage (min): 1.71 V
• Package / Case: TQFP-100
• Package: 100TQFP
• Family Name: LatticeXP
• Device Logic Units: 3000
• Maximum Internal Frequency: 320 MHz
• Typical Operating Supply Voltage: 1.8|2.5|3.3 V
• Maximum Number Of User I/os: 62
• Ram Bits: 55296
• Re-programmability Support: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Lattice Semiconductor
144-ball csBGA BGA Breakout Examples
These examples place an ispMACH 4000ZE in a 7x7 mm, 0.5 mm pitch, 144-ball csBGA package (LC4256ZE-
MN144) into two fabrication scenarios. One for a 6-layer stack up with maximum I/O utilization and a 4-layer with
about 5% fewer I/Os. The 6-layer (Example #1) design avoids uses of micro vias and takes advantage of removed
pads on inner layers to route all pins out to 6 layers with good layer structure for high-speed signal integrity.
Figure 14-8. CAM Artwork Screen Shots, Example #1, 144-ball csBGA
Layer 1 Primary
Layer 3 Signal
Layer 5 Power
14-10
Layer 6 Secondary
PCB Layout Recommendations
Layer 4 Signal
Layer 2 GND
for BGA Packages