LFXP10C-3FN256I Lattice, LFXP10C-3FN256I Datasheet - Page 387

• Manufacturer Part Number: LFXP10C-3FN256I
• Description: FPGA - Field Programmable Gate Array 9.7K LUTs 188 IO 1.8 /2.5/3.3V -3 Spd I
• Manufacturer: Lattice

Specifications of LFXP10C-3FN256I

• Number Of Programmable I/os: 188
• Data Ram Size: 221184
• Supply Voltage (max): 3.465 V
• Maximum Operating Temperature: + 100 C
• Minimum Operating Temperature: - 40 C
• Mounting Style: SMD/SMT
• Supply Voltage (min): 1.71 V
• Package / Case: FPBGA-256
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Lattice Semiconductor
256-ball caBGA BGA Breakout Examples
This BGA breakout and routing example places a MachXO PLD in a 14x14 mm, 0.8 mm pitch, 256-ball caBGA
package (LCMXO2280-B256/BN256) into two fabrication scenarios. One for a 6-layer stack up with maximum I/O
utilization and a 4-layer with about 10% fewer I/Os. The 6-layer design (Example #1), demonstrates the best use of
mechanically drill blind vias to place caps near power pins to minimize layers.
Figure 14-10. CAM Artwork Screen Shots, Example #1, 256-Ball caBGA
Layer 1 Primary
Layer 5 Signal
Layer 3 GND
14-12
Layer 6 Secondary
PCB Layout Recommendations
Layer 2 Signal
Layer 4 Power
for BGA Packages