A3P250L-FGG256 Actel, A3P250L-FGG256 Datasheet - Page 20

• Manufacturer Part Number: A3P250L-FGG256
• Description: FPGA - Field Programmable Gate Array 2.5K SYSTEM GATES
• Manufacturer: Actel

Specifications of A3P250L-FGG256

• Processor Series: A3P250
• Core: IP Core
• Maximum Operating Frequency: 781.25 MHz
• Number Of Programmable I/os: 157
• Data Ram Size: 36864
• Supply Voltage (max): 1.26 V
• Maximum Operating Temperature: + 70 C
• Minimum Operating Temperature: 0 C
• Development Tools By Supplier: A3PE-Proto-Kit, A3PE-Brd1500-Skt, Silicon-Explorer II, Silicon-Sculptor 3, SI-EX-TCA, FlashPro 4, FlashPro 3, FlashPro Lite
• Mounting Style: SMD/SMT
• Supply Voltage (min): 1.14 V
• Number Of Gates: 250 K
• Package / Case: FPBGA-256
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

ProASIC3L DC and Switching Characteristics
Table 2-5 •
2 - 6
Package Type
Very Thin Quad Flat Pack (VQFP)
Plastic Quad Flat Pack (PQFP)
PQFP with embedded heatspreader
Fine Pitch Ball Grid Array (FBGA)
Maximum Power Allowed
Thermal Characteristics
Introduction
The temperature variable in the Actel Designer software refers to the junction temperature, not the
ambient temperature. This is an important distinction because dynamic and static power consumption
cause the chip junction temperature to be higher than the ambient temperature.
EQ 1
where:
T
ΔT = Temperature gradient between junction (silicon) and ambient ΔT = θ
θ
P = Power dissipation
Package Thermal Characteristics
The device junction-to-case thermal resistivity is θ
θ
temperature is 100°C.
allowed for a 484-pin FBGA package at commercial temperature and in still air.
Package Thermal Resistivities
A
ja
ja
. The thermal characteristics for θ
= Ambient Temperature
= Junction-to-ambient of the package. θ
T
J
can be used to calculate junction temperature.
= Junction Temperature = ΔT + T
=
Max. junction temp. (°C) Max. ambient temp. (°C)
-------------------------------------------------------------------------------------------------------------------------------------- -
EQ 2
A3PE3000L
A3PE3000L
AGLE3000
All devices
All devices
All devices
A3P1000L
A3P1000L
A3P1000L
A3P250L
A3P600L
A3P250L
A3P600L
A3P600L
Device
shows a sample calculation of the absolute maximum power dissipation
ja
θ
are shown for two air flow rates. The absolute maximum junction
A
ja
(°C/W)
Pin Count
–
ja
144
R e vi s i o n 9
100
208
208
144
144
256
256
256
324
484
484
484
896
numbers are located in
jc
and the junction-to-ambient air thermal resistivity is
10.0
12.2
12.0
TBD
8.0
3.8
8.3
6.3
6.6
9.5
8.0
4.7
2.4
θ
8.5
jc
Still Air 200 ft./min.
35.3
26.1
16.2
31.6
28.1
TBD
27.5
23.3
20.6
13.6
43.8
35.8
38.6
32.0
Table
=
100°C 70°C
------------------------------------
ja
29.4
13.3
26.2
24.4
TBD
21.9
19.0
15.7
22.5
10.4
37.7
20.5°C/W
30.2
34.7
27.5
2-5.
* P
θ
ja
–
500 ft./min.
=
TBD
27.1
20.8
11.9
35.8
28.3
24.2
33.0
25.8
20.2
16.7
14.0
22.7
9.4
1.463 W
Units
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
EQ 1
EQ 2