A54SX32A-PQG208 Actel, A54SX32A-PQG208 Datasheet - Page 33
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A54SX32A-PQG208
Manufacturer Part Number
A54SX32A-PQG208
Description
FPGA - Field Programmable Gate Array 48K System Gates
Manufacturer
Actel
Datasheet
1.A54SX08A-TQG100.pdf
(108 pages)
Specifications of A54SX32A-PQG208
Processor Series
A54SX32
Core
IP Core
Number Of Macrocells
1800
Maximum Operating Frequency
350 MHz
Number Of Programmable I/os
249
Delay Time
4 ns to 8.4 ns
Supply Voltage (max)
5.25 V
Maximum Operating Temperature
+ 70 C
Minimum Operating Temperature
0 C
Development Tools By Supplier
Silicon-Explorer II, Silicon-Sculptor 3, SI-EX-TCA
Mounting Style
SMD/SMT
Supply Voltage (min)
2.25 V
Number Of Gates
32 K
Package / Case
PQFP-208
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
A54SX32A-PQG208
Manufacturer:
Actel
Quantity:
135
Company:
Part Number:
A54SX32A-PQG208
Manufacturer:
ACTEL
Quantity:
16
Company:
Part Number:
A54SX32A-PQG208
Manufacturer:
Microsemi SoC
Quantity:
10 000
Part Number:
A54SX32A-PQG208
Manufacturer:
ACTEL/爱特
Quantity:
20 000
Company:
Part Number:
A54SX32A-PQG208A
Manufacturer:
Microsemi SoC
Quantity:
10 000
Company:
Part Number:
A54SX32A-PQG208I
Manufacturer:
Microsemi SoC
Quantity:
10 000
To determine the heat sink's thermal performance, use the following equation:
where:
A heat sink with a thermal resistance of 9.76°C/W or better should be used. Thermal resistance of heat sinks is a
function of airflow. The heat sink performance can be significantly improved with the presence of airflow.
Carefully estimating thermal resistance is important in the long-term reliability of an Actel FPGA. Design engineers
should always correlate the power consumption of the device with the maximum allowable power dissipation of the
package selected for that device, using the provided thermal resistance data.
Note: The values may vary depending on the application.
θ
θ
CS
SA
=
=
=
0.37°C/W
thermal resistance of the interface material between the case and the heat
sink, usually provided by the thermal interface manufacturer
thermal resistance of the heat sink in °C/W
θ
SA
=
13.33°C/W 3.20°C/W
θ
θ
JA(TOTAL)
SA
=
θ
SA
θ
JA(TOTAL)
=
=
–
v5.3
9.76°C/W
θ
JC
+
–
θ
θ
CS
JC
+
–
–
θ
θ
CS
SA
0.37°C/W
SX-A Family FPGAs
EQ 2-15
EQ 2-14
2-13