UPG2176T5N-A CEL, UPG2176T5N-A Datasheet - Page 6

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UPG2176T5N-A

Manufacturer Part Number
UPG2176T5N-A
Description
RF Switch ICs SPDT for WiMAX
Manufacturer
CEL
Datasheet

Specifications of UPG2176T5N-A

Insertion Loss
0.45 dB to 0.70 dB
Mounting Style
SMD/SMT
Off Isolation (typ)
21 dB to 27 dB
Operating Frequency
2.3 GHz to 5.85 GHz
Switch Configuration
SPDT
Package / Case
TSON-6
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
RECOMMENDED SOLDERING CONDITIONS
methods and conditions other than those recommended below, contact your nearby sales office.
6
Infrared Reflow
Wave Soldering
Partial Heating
Caution Do not use different soldering methods together (except for partial heating).
This product should be soldered and mounted under the following recommended conditions.
S
o
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M
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Peak temperature (package surface temperature)
i T
Time at temperature of 220°C or higher
Preheating time at 120 to 180°
Maximum number of reflow processes
Maximum chlorine content of rosin flux (% mass)
Peak temperature (molten solder temperature)
i T
Preheating temperature (package surface temperature) : 120°C or below
Maximum number of flow processes
Maximum chlorine content of rosin flux (% mass)
Peak temperature (terminal temperature)
Soldering time (per side of device)
Maximum chlorine content of rosin flux (% mass)
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m
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p
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Data Sheet PG10677EJ01V0DS
e r
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S
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C
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C
o
n
d
t i
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s
: 260°C or below
:
: 60 seconds or less
:
: 3 times
: 0.2%(Wt.) or below
: 260°C or below
:
: 1 time
: 0.2%(Wt.) or below
: 350°C or below
: 3 seconds or less
: 0.2%(Wt.) or below
1
1
1
0
2
0
0
s
s
±30 seconds
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C
μ
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PG2176T5N
d
WS260
t i
HS350
For soldering
IR260
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S
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