B57371V2474J60 EPCOS Inc, B57371V2474J60 Datasheet - Page 10

Thermistors - NTC NTC Thermistor 0603 470K J 60 B-4480

B57371V2474J60

Manufacturer Part Number
B57371V2474J60
Description
Thermistors - NTC NTC Thermistor 0603 470K J 60 B-4480
Manufacturer
EPCOS Inc
Series
B57371V2r
Type
NTCr
Datasheet

Specifications of B57371V2474J60

Resistance
470 KOhms
Tolerance
5 %
Termination Style
SMD/SMT
Package / Case
0603
Dimensions
0.8 mm W x 1.6 mm L
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
B57371V2474J060
Mounting instructions
1
1.1
SMD NTC thermistors can be provided with a nickel barrier termination or on special request with
silver-palladium termination. The usage of mild, non-activated fluxes for soldering is recommend-
ed as well as a proper cleaning of the PCB.
The nickel barrier layer of the silver/nickel/tin termination (see figure 1) prevents leaching of the
silver base metalization layer. This allows great flexibility in the selection of soldering parameters.
The tin prevents the nickel layer from oxidizing and thus ensures better wetting by the solder. The
nickel barrier termination is suitable for all commonly-used soldering methods.
Figure 1
SMD NTC thermistors, structure of nickel barrier termination
1.1.1
Preconditioning: Immersion into flux F-SW 32.
Evaluation criterion: Wetting of soldering areas 95%.
Solder
SnPb 60/40
SnAg (3.0 ... 4.0), Cu (0.5 ... 0.9)
1.1.2
Preconditioning: Immersion into flux F-SW 32.
Evaluation criterion: Leaching of side edges 1/3.
Solder
SnPb 60/40
SnAg (3.0 ... 4.0), Cu (0.5 ... 0.9)
Please read Cautions and warnings and
Important notes at the end of this document.
Temperature measurement and compensation
SMD NTC thermistors, case size 0603 (1608)
Nickel barrier termination
Soldering
SMD NTC thermistors
Solderability (test to IEC 60068-2-58)
Resistance to soldering heat (test to IEC 60068-2-58)
Page 10 of 20
Bath temperature ( C)
215 3
245 3
Bath temperature ( C)
260
260
5
5
Dwell time (s)
3
3
Dwell time (s)
10
10
B573**V2

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